Magnetotransport properties of a polarization-doped three-dimensional electron slab

We present evidence of strong Shubnikov-de-Haas magnetoresistance oscillations in a polarization-doped degenerate three-dimensional electron slab in an Al$_{x}$Ga$_{1-x}$N semiconductor system. The degenerate free carriers are generated by a novel technique by grading a polar alloy semiconductor with spatially changing polarization. Analysis of the magnetotransport data enables us to extract an effective mass of $m^{\star}=0.19 m_{0}$ and a quantum scattering time of $\tau_{q}= 0.3 ps$. Analysis of scattering processes helps us extract an alloy scattering parameter for the Al$_{x}$Ga$_{1-x}$N material system to be $V_{0}=1.8eV$

Polarization effects in AlGaN/GaN and GaN/AlGaN/GaN heterostructures

The influence of AlGaN and GaN cap layer thickness on Hall sheet carrier density and mobility was investigated for Al0.32Ga0.68N/GaN and GaN/Al0.32Ga0.68N/GaN heterostructures deposited on sapphire substrates. The sheet carrier density was found to increase and saturate with the AlGaN layer thickness, while for the GaN-capped structures it decreased and saturated with the GaN cap layer thickness. A relatively close fit was achieved between the measured data and two-dimensional electron gas densities predicted from simulations of the band diagrams. The simulations also indicated the presence of a two-dimensional hole gas at the upper interface of GaN/AlGaN/GaN structures with sufficiently thick GaN cap layers. A surface Fermi-level pinning position of 1.7 eV for AlGaN and 0.9-1.0 eV for GaN, and an interface polarization charge density of 1.6x10(13)-1.7x10(13) cm(-2), were extracted from the simulations. (C) 2003 American Institute of Physics

A GaN Differential Oscillator With Improved Harmonic Performance

The first AlGaN/GaN HEMT based differential oscillator is reported. The MMIC oscillates at a frequency of 4.16 GHz and provides 22.9 dBm of power from one side at a biasing of Vgs -1 V and Vds 20 V. The HEMTs each have a 0.7 um x 200 um gate. The second harmonic is 45 dB below the carrier and the third harmonic is more than 70 dB below the carrier. To our knowledge, this is the best reported harmonic performance for a GaN oscillator. The oscillator efficiency is between 4% and 9.4% depending on bias. The measured phase noise is -86.3 dBc and -115.7 dBc at offsets of 100 kHz and 1 MHz respectively. The phase noise at a 1 MHz offset is similar to the noise performance of FET based differential oscillators in other technologies

A GaN Differential Oscillator With Improved Harmonic Performance

The first AlGaN/GaN HEMT based differential oscillator is reported. The MMIC oscillates at a frequency of 4.16 GHz and provides 22.9 dBm of power from one side at a biasing of Vgs -1 V and Vds 20 V. The HEMTs each have a 0.7 um x 200 um gate. The second harmonic is 45 dB below the carrier and the third harmonic is more than 70 dB below the carrier. To our knowledge, this is the best reported harmonic performance for a GaN oscillator. The oscillator efficiency is between 4% and 9.4% depending on bias. The measured phase noise is -86.3 dBc and -115.7 dBc at offsets of 100 kHz and 1 MHz respectively. The phase noise at a 1 MHz offset is similar to the noise performance of FET based differential oscillators in other technologies

Influence of Epitaxial Structure in the Noise Figure of AlGaN/GaN HEMTs

The effect of noise figure of different AlGaN/GaN high electron-mobility transistor (HEMT) epitaxy structures is reported. The addition of a thin AlN layer between the barrier and channel gives better performance at biasings other than the best for minimum noise figure. However, varying Al composition in the HEMT barrier does not change the noise performance, contrary to a 2003 study by Lu et al. The measurements are checked with both the Pospieszalski and van der Ziel (Pucel) models. The models are used on six different samples, helping to reinforce the measurements and showing the strengths and weaknesses of each

p-Gan cap layer for dispersion control in AlGaN/GaN HEMTs

The role of using p-doped cap layers with the aim of reducing GaN-HEMTs current collapse is presented and discussed

A new field-plated GaN HEMT structure with improved power and noise performance

Field-plated structures can dramatically improve power capacity of GaN HEMT devices. In this paper, two different field-plated GaN HEMT structures will be demonstrated and compared to each other. The results show that a new GaN HEMT structure improves both power and noise performance without additional processing or costs