Chemical-mechanical polishing: Enhancing the manufacturability of MEMS

The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi-level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology in Micro Electro Mechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film issues generated by severe topography, but also enables far greater flexibility with process complexity and associated designs. Thus, the CMP planarization technique alleviates processing problems associated with fabrication of multi-level polysilicon structures, eliminates design constraints linked with non-planar topography, and provides an avenue for integrating different process technologies. Examples of these enhancements include: an simpler extension of surface micromachining fabrication to multiple mechanical layers, a novel method of monolithic integration of electronics and MEMS, and a novel combination of bulk and surface micromachining

MEMS: A new approach to micro-optics

MicroElectroMechanical Systems (MEMS) and their fabrication technologies provide great opportunities for application to micro-optical systems (MOEMS). Implementing MOEMS technology ranges from simple, passive components to complicated, active systems. Here, an overview of polysilicon surface micromachining MEMS combined with optics is presented. Recent advancements to the technology, which may enhance its appeal for micro-optics applications are emphasized. Of all the MEMS fabrication technologies, polysilicon surface micromachining technology has the greatest basis in and leverages the most the infrastructure for silicon integrated circuit fabrication. In that respect, it provides the potential for very large volume, inexpensive production of MOEMS. This paper highlights polysilicon surface micromachining technology in regards to its capability to provide both passive and active mechanical elements with quality optical elements

A novel method to characterize the elastic/plastic deformation response of thin films

A novel experimental/numerical test method has been developed which allows accurate characterization of the elastic and large-strain plastic mechanical response of thin films. Silicon micromachining techniques have been used to fabricate isolated film features which are mechanically tested using our ultralow-load indentation test system. Macro-scale laboratory testing and finite element analysis were employed to optimize the design of the geometric feature used and to benchmark our analysis capabilities. A simple rigid-plastic geometric analysis of our test structure is developed and applied to the observed force-displacement response, allowing us to extract the uniaxial inelastic stress-strain response of micrometer-scale thin film structures. To our knowledge, this is the first time that the inelastic deformation behavior of metal alloy features of this size scale has been quantitatively determined

Thin teflon-like films for eliminating adhesion in released polysilicon microstructures

This paper presents a method for depositing thin Teflon-like films using a commercial plasma reactor to eliminate adhesion or stiction in released polysilicon microstructures. A Lam 384T oxide etch system is used in a remote plasma mode with commercially available trifluoromethane (CHF{sub 3}) to deposit thin hydrophobic films around and under released microstructures. Hard, uniform, Teflon-like films which penetrate into undercuts beneath structures have been produced. Thus far, surfaces beneath gears as large as 1600 micron diameter with a gap of 2.0 microns are hydrophobic after being exposed to plasma treatment. These Teflon-like coatings have been shown to reduce the coefficient of friction from 1.0 to 0.07

Material and processing issues for the monolithic integration of microelectronics with surface-micromachined polysilicon sensors and actuators

The monolithic integration of micromechanical devices with their controlling electronics offers potential increases in performance as well as decreases in cost for these devices. Analog Devices has demonstrated the commercial viability of this integration by interleaving the micromechanical fabrication steps of an accelerometer with the microelectronic fabrication steps of its controlling electronics. Sandia`s Microelectronics Development Laboratory has integrated the micromechanical and microelectronic processing sequences in a segregated fashion. In this CMOS-first, micromechanics-last approach, conventional aluminum metallization is replaced by tungsten metallization to allow CMOS to withstand subsequent high-temperature processing during the micromechanical fabrication. This approach is a further development of an approach originally developed at UC Berkeley. Specifically, the issues of yield, repeatability, and uniformity of the tungsten/CMOS approach are addressed. Also, material issues related to the development of high-temperature diffusion barriers, adhesion layers, and low-stress films are discussed. Processing and material issues associated with alternative approaches to this integration such as micromechanics- first, CMOS-last or the interleaved process are also discussed

Characterization of the embedded micromechanical device approach to the monolithic integration of MEMS with CMOS

Recently, a great deal of interest has developed in manufacturing processes that allow the monolithic integration of MicroElectroMechanical Systems (MEMS) with driving, controlling, and signal processing electronics. This integration promises to improve the performance of micromechanical devices as well as lower the cost of manufacturing, packaging, and instrumenting these devices by combining the micromechanical devices with a electronic devices in the same manufacturing and packaging process. In order to maintain modularity and overcome some of the manufacturing challenges of the CMOS-first approach to integration, we have developed a MEMS-first process. This process places the micromechanical devices in a shallow trench, planarizes the wafer, and seals the micromechanical devices in the trench. Then, a high-temperature anneal is performed after the devices are embedded in the trench prior to microelectronics processing. This anneal stress-relieves the micromechanical polysilicon and ensures that the subsequent thermal processing associated with fabrication of the microelectronic processing does not adversely affect the mechanical properties of the polysilicon structures. These wafers with the completed, planarized micromechanical devices are then used as starting material for conventional CMOS processes. The circuit yield for the process has exceeded 98%. A description of the integration technology, the refinements to the technology, and wafer-scale parametric measurements of device characteristics is presented. Additionally, the performance of integrated sensing devices built using this technology is presented

Failure modes in surface micromachined microelectromechanical actuators

In order for the rapidly emerging field of MicroElectroMechanical Systems (MEMS) to meet its extraordinary expectations regarding commercial impact, issues pertaining to how they fail must be understood. The authors identify failure modes common to a broad range of MEMS actuators, including adhesion (stiction) and friction induced failures caused by improper operational methods, mechanical instabilities, and electrical instabilities. Demonstrated methods to mitigate these failure modes include implementing optimized designs, model based operational methods, and chemical surface treatments

Micromachining technology for advanced weapon systems

An overview of planned uses for polysilicon surface-micromachining technology in advanced weapon systems is presented. Specifically, this technology may allow consideration of fundamentally new architectures for realization of surety component functions

Macrodesign for microdevices: Polysilicon surface-micromachining technology, applications and issues

The intent of this tutorial is to overview the technology of multi-level polysilicon surface micromachining, to present examples of devices which fully utilize this level of complexity, and to discuss what they believe to be significant issues which are not fully resolved. Following this intent, the tutorial consists of four sections. The first is an introduction and description of multi-level polysilicon surface micromachining and its potential benefits. Specifically, the inclusion of a third deposited layer of mechanical polysilicon greatly extends the degree of complexity available for micromechanism design. The second section introduces wafer planarization by CMP as a process tool for surface micromachining. The third section presents examples of actuated geared micromechanisms which require the multi-level fabrication process. Demonstration of actuation mechanisms coupled to external devices are illustrated. Finally, polysilicon surface micromachining fabrication technology has reached a level where many device designs, for the most part, can be embodied in the technology to produce a mechanical construct which provides the desired function. When designed properly, the fabricated mechanical element, if free to operate, will produce the desired function. However, one set of issues which can hinder or prevent operation are related to the post-fabricated device surfaces. These surface issues; namely, stiction, friction, and wear, are emphasized in the final section as a major hindrance to realizing the full potential of surface micromachined devices

Tribological issues of polysilicon surface-micromachining

Polysilicon surface-micromachining is a Micro-Electro-Mechanical Systems (MEMS) manufacturing technology where the infrastructure for manufacturing silicon integrated circuits is used to fabricate micro-miniature mechanical devices. This presentation describes a multi-level mechanical polysilicon surface-micromachining technology and includes a discussion of the issues which affect device manufacture and performance. The multi-level technology was developed and is employed primarily to fabricate microactuated mechanisms. The intricate and complex motion offered by these devices is naturally accompanied by various forms of fraction and wear in addition to the classical stiction phenomena associated with micromechanical device fabrication and usage