Non-parabolic hydrodynamic formulations for the simulation of inhomogeneous semiconductor devices

Hydrodynamic models are becoming prevalent design tools for small scale devices and other devices in which high energy effects can dominate transport. Most current hydrodynamic models use a parabolic band approximation to obtain fairly simple conservation equations. Interest in accounting for band structure effects in hydrodynamic device simulation has begun to grow since parabolic models can not fully describe the transport in state of the art devices due to the distribution populating non-parabolic states within the band. This paper presents two different non-parabolic formulations of the hydrodynamic model suitable for the simulation of inhomogeneous semiconductor devices. The first formulation uses the Kane dispersion relationship (hk)(exp 2)/2m = W(1 + alpha(W)). The second formulation makes use of a power law ((hk)(exp 2)/2m = xW(sup y)) for the dispersion relation. Hydrodynamic models which use the first formulation rely on the binomial expansion to obtain moment equations with closed form coefficients. This limits the energy range over which the model is valid. The power law formulation readily produces closed form coefficients similar to those obtained using the parabolic band approximation. However, the fitting parameters (x,y) are only valid over a limited energy range. The physical significance of the band non-parabolicity is discussed as well as the advantages/disadvantages and approximations of the two non-parabolic models. A companion paper describes device simulations based on the three dispersion relationships: parabolic, Kane dispersion, and power low dispersion

Theoretical study of the effect of an AlGaAs double heterostructure on metal-semiconductor-metal photodetector performance

The sizing and efficiency of an aircraft is largely determined by the performance of its high-lift system. Subsonic civil transports most often use deployable multi-element airfoils to achieve the maximum-lift requirements for landing, as well as the high lift-to-drag ratios for take-off. However, these systems produce very complex flow fields which are not fully understood by the scientific community. In order to compete in today's market place, aircraft manufacturers will have to design better high-lift systems. Therefore, a more thorough understanding of the flows associated with these systems is desired. Flight and wind-tunnel experiments have been conducted on NASA Langley's B737-100 research aircraft to obtain detailed full-scale flow measurements on a multi-element high-lift system at various flight conditions. As part of this effort, computational aerodynamic tools are being used to provide preliminary flow-field information for instrumentation development, and to provide additional insight during the data analysis and interpretation process. The purpose of this paper is to demonstrate the ability and usefulness of a three-dimensional low-order potentialflow solver, PMARC, by comparing computational results with data obtained from 1/8 scale wind-tunnel tests. Overall, correlation of experimental and computational data reveals that the panel method is able to predict reasonably well the pressures of the aircraft's multi-element wing at several spanwise stations. PMARC's versatility and usefulness is also demonstrated by accurately predicting inviscid threedimensional flow features for several intricate geometrical regions

Light confinement and hydrodynamic modeling of semiconductor structures by volumetric methods

Ph.D.Ajeet Rohatg

Modeling of Forced Flow/Thermal Gradient Chemical Vapor Infiltration

The forced flow/thermal gradient chemical vapor infiltration process (FCVI) has proven to be a successful technique for fabrication of ceramic matrix composites. It is particularly attractive for thick components which cannot be fabricated using the conventional, isothermal method (ICVI). Although it offers processing times that are at least an order of magnitude shorter than ICVI, FCVI has not been used to fabricate parts of complex geometry and is perceived by some to be unsuitable for such components. The major concern Is that selection and control of the flow pattern and thermal profile for optimum infiltration can be a difficult and costly exercise. In order to reduce this effort, we are developing a computer model for FCVI that simulates the densification process for given component geometry, reactor configuration and operating parameters. Used by a process engineer, this model can dramatically reduce the experimental effort needed to obtain uniform densification. A one-dimensional process model, described in a previous interim report, has demonstrated good agreement with experimental results in predicting overall densification time and density uniformity during processing and the effect of various fiber architectures and operating parameters on these process issues. This model is fundamentally unsuitable for more complex geometries, however, and extension to two- and three-dimensions is necessary. This interim report summarizes our progress since the previous interim report toward development of a finite volume'' model for FCVI

Finite Volume Model for Forced Flow/Thermal Gradient Chemical Vapor Infiltration

The forced flow/thermal gradient chemical vapor infiltration process (FCVI) has proven to be a successfully technique for fabrication of ceramic matrix composites. It is particularly attractive for thick components which cannot be fabricated using the conventional, isothermal method (ICVI). Although it offers processing times that are at least an order of magnitude shorter than ICVI, FCVI has not been used to fabricate parts of complex geometry and is perceived by many to be unsuitable for such components. The major concern is that selection and control of the flow pattern and thermal profile for optimum infiltration can be a difficult and costly exercise. In order to reduce this effort, we are developing a computer model for FCVI that simulates the densification process for given component geometry, reactor configuration and operating parameters. Used by a process engineer, this model can dramatically reduce the experimental effort needed to obtain uniform densification