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13 research outputs found
Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling
Author
B. Wang
C.-L. Yeh
+17 more
C.R. Siviour
C.S. Selvanayagam
D.R. Frear
E.H. Wong
H.D. Solomon
I. Shohji
J.F.J.M. Caers
K. Kawashima
L.C. Tan
M. Leoni
N. Owens
P.J. Wray
S. Clyens
S.K.W. Seah
W.D. van Driel
X.J. Zhao
Y.-S. Lai
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking
Author
A. Paul
C.-C. Liu
+23 more
C.C. Lee
D.M. Jacobson
F.G. Yost
F.S. Shieu
G.I. Shohji
J. Bjontegaard
J. Haimovich
L. Bernstein
M. Millares
M. Mori
M. Paulasto
M. Waelti
N. Quitoriano
P. Vianco
T. Laurila
T.B. Wang
V. Simic
W. Ruythooren
W. Zhang
W. Zhang
W.W. So
Y. Hasumi
Y.M. Liu
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate
Author
A. Contreras
C. Kanchanomai
+26 more
D. Q. Yu
D. Q. Yu
D. Suh
F. Rosalbino
H. Flandorfer
HongXin Zhao
I. Shohji
J. B. Wan
J. G. Li
J. Li
J. Li
J. Li
JianQiang Li
K. M. Kumar
K. N. Tu
K. W. Moon
L. Dou
LiKun Zang
M. F. Arenas
M. N. Islam
X. P. Zhang
X. P. Zhang
X. Wei
XiaoRui Zhang
Z. Yuan
ZhangFu Yuan
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
On the Strain Rate- and Temperature-Dependent Tensile Behavior of Eutectic Sn–Pb Solder
Author
Anand
Andersson
+48 more
B. L. Boyce
Bai
Bleck
Boyce
Brewer
Brewer
Busso
Chong
Ding
El-Daly
Flanagan
Fossum
Frear
Frear
Garofalo
Gilat
He
Johnson
Johnson
Juhász
Kim
Knecht
Kumar
L. N. Brewer
Liu
Long
M. J. Perricone
M. K. Neilsen
Mccabe
More
Nie
Nieh
Niu
Nose
Ohguchi
Plumbridge
Qin
Regazzoni
Shin
Shohji
Siviour
Stephens
Telang
Telang
Wong
Xiaoyan
Zelin
Zhu
Publication venue
'ASME International'
Publication date
Field of study
No full text
Crossref
A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu
Author
Ai-bin Yu
C. Lee
+29 more
C.C. Lee
Cheng-kuo Lee
D.G. Kim
D.R. Frear
Da-quan Yu
G. Humpston
I. Shohji
J.M. Koo
J.W. Morris Jr.
John-H Lau
K.N. Tu
L.Y. Hsiao
Li-ling Yan
N. Miki
P.T. Vianco
R.W. Chuang
S. Sommadossi
S. Sommadossi
S. Sommadossi
S.W. Chen
S.W. Chen
Seung-Uk Yoon
T.H. Chuang
T.H. Chuang
T.H. Chuang
T.K. Lee
Won-Kyoung Choi
Y.M. Liu
Z. Mei
Publication venue
'Springer Science and Business Media LLC'
Publication date
01/01/2009
Field of study
No full text
10.1007/s11664-008-0561-xJournal of Electronic Materials381200-207JECM
Crossref
ScholarBank@NUS
A quantitative evaluation of time-independent and time-dependent deformations of lead-free and lead-containing solder alloys
Author
C. Basaran
C. Kanchanomai
+31 more
C.-Y. Fu
C.-Y. Fu
C.H. Raeder
G.Z. Wang
H. Ishikawa
H. Ishikawa
H.D. Solomon
I. Dutta
I. Shohji
J.H. Lau
J.M. Song
K. Ohguchi
K. Ohguchi
K. Ohguchi
K. Sasaki
Katsuhiko Sasaki
Ken-Ichi Ohguchi
L. Maciucescu
M. Amagai
M.W. Woodmansee
Masahiro Ishibashi
N. Ohno
R. Chandary
R.J. McCabe
R.S. Whitelaw
S. Vaynman
S. Wiese
S. Yi
W. Ren
X.Q. Shi
Y.-W. Cheng
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Influence of Cu addition on intermetallic compound formation and microstructure of Sn–3Ag–1˙5Sb– x
Author
Abtew M.
Chada S.
+33 more
Chen B. L.
Chen B. L.
Cole M.
Flanders D. R.
Frear D. R.
Gagliano R. A.
H. T. Lee
Ho C. E.
Igoshev V. I.
Islam M. N.
Kang S. K.
Kang S. K.
Kariya Y.
Kim H. K.
Kim K. S.
Kim S. W.
Kim Y. S.
Lee H. T.
Lee H. T.
Lee Y. G.
Li G. Y.
Loomans M. E.
Masson D. B.
Moon K. W.
Reynolds H. L.
Shohji I.
Tu K. N.
Tu K. N.
Turbini L. J.
W. Y. Huang
Wu C. M. L.
Y. F. Chen
Yoon S. W.
Publication venue
'Maney Publishing'
Publication date
Field of study
No full text
Crossref
Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au Couples
Author
B. Peplinski
B.D. Cullity
+40 more
B.J. Lee
C.M. Miller
Chiapyng Lee
Chien-Chung Jao
Chung-Yung Lin
D. Fontaine de
D. Gregersen
D.S. Evans
E. Gebhardt
E.B. Hannech
H. Okamoto
H. Okamoto
H. Sato
H.M. Lee
Hsien-Ming Hsiao
I. Karakaya
I. Ohnuma
I. Shohji
J. Kim
J.F. Roder
J.Y. Park
J.Y. Tsai
K.W. Moon
M. Mita
M.E. Loomans
M.L. Malhotra
N. Saunders
O.B. Karlsen
O.B. Karlsen
O.B. Karlsen
O.B. Karlsen
P.G. Kim
P.G. Kim
S. Nakahara
S. Nakahara
S.K. Sharma
S.W. Chen
T.B. Massalski
Y.W. Yen
Yee-Wen Yen
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Synergetic effect of strain rate and electroplated Cu film for shear strength of solder/Kovar joints
Author
A Kumar
A Sharif
+50 more
B Lee
B Lee
BL Young
BS Lee
CY Liu
DH Jung
EP Lopez
F Lang
H Fei
HJ Lin
HT Lee
HT Lee
I Shohji
J Wei
JW Yoon
JW Yoon
JW Yoon
JWR Teo
JY Tsai
KE Yazzie
KE Yazzie
KJ Puttlitz
LJ Yu
MJ Starink
N Bai
Nifa Bao
Q Li
RB Cinque
SF Choudhury
SJ Wang
SK Kang
T An
TA Powers
TF Song
TK Lee
TL Yang
TL Yang
W Chen
W Zhu
WM Chen
X Hu
X Hu
X Hu
Xiaowu Hu
Y Li
Y Wan
YJ Chen
Z Huber
Zhixian Min
ZX Zhu
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Electrochemical Cleavage of Sulfonamides: An Efficient and Tunable Strategy to Prevent β-Fragmentation and Epimerization
Author
Ankner T.
Blay G.
+43 more
Christine Thobie-Gautier
Cintrat J.-C.
Cintrat J.-C.
Cintrat J.-C.
Civitello E. R.
Coeffard V.
Coeffard V.
Coeffard V.
Coeffard V.
Das I.
Deck J. A.
Dunach E.
Erwan Le Grognec
Fains O.
Frontana-Uribe B. A.
Horner L.
Isabelle Beaudet
Jean-Paul Quintard
Jensen K. L.
Kells K. W.
Knowles H. S.
Knowles H. S.
Kocienski P. J.
Kong K.
Kozuka S.
Kuriyama M.
Lebouc A.
Liu Y.
Lund H.
Mairanovsky V. G.
Moussa Z.
Nicolas Galland
Nyasse B.
Parsons A. F.
Pierre Viaud
Senboku H.
Shohji N.
Vedejs E.
Vincent Coeffard
Witulski B.
Wuts P. G. M.
Yasuhara A.
Yoshida J.-i.
Publication venue
'American Chemical Society (ACS)'
Publication date
Field of study
No full text
Crossref
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