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    Atomic Layer Deposition of Al<sub>2</sub>O<sub>3</sub> on WSe<sub>2</sub> Functionalized by Titanyl Phthalocyanine

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    To deposit an ultrathin dielectric onto WSe<sub>2</sub>, monolayer titanyl phthalocyanine (TiOPc) is deposited by molecular beam epitaxy as a seed layer for atomic layer deposition (ALD) of Al<sub>2</sub>O<sub>3</sub> on WSe<sub>2</sub>. TiOPc molecules are arranged in a flat monolayer with 4-fold symmetry as measured by scanning tunneling microscopy. ALD pulses of trimethyl aluminum and H<sub>2</sub>O nucleate on the TiOPc, resulting in a uniform deposition of Al<sub>2</sub>O<sub>3</sub>, as confirmed by atomic force microscopy and cross-sectional transmission electron microscopy. The field-effect transistors (FETs) formed using this process have a leakage current of 0.046 pA/μm<sup>2</sup> at 1 V gate bias with 3.0 nm equivalent oxide thickness, which is a lower leakage current than prior reports. The n-branch of the FET yielded a subthreshold swing of 80 mV/decade
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