12 research outputs found

    Anti-tissue transglutaminase antibodies in inflammatory and degenerative arthropathies

    Get PDF
    Recent studies identified tissue transglutaminase (tTG) as the antigen eliciting antiendomysial antibodies (EMA) in celiac disease (CD). Anti-tTG antibodies have therefore been proposed as a serological test for CD. Nevertheless, IgA anti-tTG but not EMA have also been found in inflammatory bowel disease patients, suggesting that these antibodies are linked to a tissue lesion rather than to an auto-immune component of CD. To confirm this hypothesis, we evaluated the presence of IgA anti-tTG in patients with inflammatory and degenerative diseases, in whom tissue lesions presented far away from the intestinal mucosa. The study was carried out on the serum and synovial fluid (SF) of 68 patients with rheumatoid arthritis (RA=33), psoriatic arthritis (PsA=26) and osteoarthritis (OA=9). In RA, PsA and OA sera, IgA anti-tTG were positive in 33%, 42% and 11% of patients, respectively. Serum anti-tTG levels were significantly higher in RA (p<0.0001), PsA (p<0.0001) and OA (p<0.02) with respect to healthy controls. SF anti-tTG levels were significantly higher in PsA (p<0.018) than in OA. A good correlation between serum and synovial fluid anti-tTG levels was found in all arthropathies This study suggests that tTG is not the only antigen of EMA and, furthermore , that IgA anti-tTG antibodies represent a general lesion-associated event. Moreover, the significant correlation between serum and synovial fluid anti-tTG levels allow us to hypothesise that these antibodies could be synthesized in the site of arthritic lesions

    31-43 AMINOACIDIC SEQUENCE OF THE ALPHA-GLIADIN INDUCES ANTIENDOMYSIAL ANTIBODY PRODUCTION DURING IN VITRO CHALLENGE

    No full text

    Type 1 diabetes mellitus and celiac disease: endothelial dysfunction

    No full text
    Many reports indicate a hypercoagulative state in diabetes mellitus as result of endothelial damage. Experimental evidence suggests that a metabolic derangement triggers a cascade of biochemical events that lead to vascular dysfunction. The net effect is to convert the endothelium from thromboresistant to thrombogenic surface. In literature, a strong association between type 1 diabetes mellitus (DM1) and celiac disease (CD) has been reported. We do not have information about the hemostatic system in these associated conditions. Our study aims at evaluating whether the presence of CD in a group of DM1 patients is associated with a different expression of some hemostatic factors and with a different manifestation and/or progression of microvascular complications of DM1 in comparison with patients with only diabetes. Ninety-four adult DM1 patients were enrolled in the study and subsequently screened for CD. Anti-endomysial antibodies (EMA) were positive in 13 of 94 DM1 patients (13.8%). CD diagnosis was confirmed by histology and organ culture. The mean age and duration of DM1 of patients also affected by CD were similar to those of only diabetic patients, but the metabolic control and the hemocoagulative parameters were significantly different between the two groups: DM1 patients also affected by CD presented significantly lower concentrations of glycosylated hemoglobin (HbA1c) (P < 0.05), cholesterol (P < 0.001), triglycerides (P < 0.001), factor VII antigen (FVII:ag) (P < 0.005), factor VII coagulant activity (FVII:c) (P < 0.05), and prothrombin degradation fragments (F1+2) (P < 0.001), as well as higher values of activated C protein (APC) (<0.001). No retinal abnormalities and no signs of renal damage were observed in DM1 patients also affected by CD. Our results suggest a potential protective role of CD in the prothrombotic state of DM1

    Dielectric Micro- and Sub-Micrometric Spacers for High-Temperature Energy Converters

    No full text
    Dielectric microspacers (DMS) are important components in thermal energy converters. Engineered DMS are fabricated and characterized on different substrates by depositing patterned ceramic thin films of alumina (Al2O3) and zirconia (ZrO2) with a thickness ranging from 0.3 to 3 Όm. Both Al2O3 and ZrO2 films are electrically and thermally optimized, finding zirconia more suitable as a thermal and electrical insulating material at high temperature, whereas the developed DMS are morphologically analyzed by scanning electron microscopy. The analysis of thermal simulations carried out with COMSOL Multiphysics allows identifying the best geometrical constraints for each single structure, whereas simulations carried out by the Fluent software allow identifying the best arrangement for DMS, leading to a solution with optimized pattern in terms of amount and spatial distribution so to achieve the required electrical and thermal insulation for practical applications. DMS are integrated within thermionic-photovoltaic devices to be validated experimentally, and enhanced electron emission measurements are successfully performed at a cathode temperature up to 1350 °C to verify the operational feasibility and potential of this technology

    AMADEUS: Next Generation Materials and Solid State Devices for Ultra High Temperature Energy Storage and Conversion

    Full text link
    Starting in January 2017, AMADEUS (www.amadeus-project.eu) is the first project funded by the European Commission to research on a new generation of materials and solid state devices for ultra-high temperature energy storage and conversion. By exploring storage temperatures well beyond 1000 ÂșC the project aims at breaking the mark of ~ 600ÂșC rarely exceeded by current state of the art thermal energy storage (TES) systems. AMADEUS Project, through a collaborative research between seven European partners, aims to develop a novel concept of latent heat thermal energy storage (LHTES) systems with unprecedented high energy density. One of the main objectives of the project is to create new PCMs (phase change materials) with latent heat in the range of 1000-2000 kWh/m3, an order of magnitude greater than that of typical salt-based PCMs used in concentrated solar power (CSP), along with developing advanced thermal insulation, PCM casing designs, and novel solid-state heat to power conversion technologies able to operate at temperatures in the range of 1000-2000 ÂșC
    corecore