Role of the Y134F mutation in cyp51 and overexpression of cyp51 in the sensitivity response of Puccinia triticina to epoxiconazole

a b s t r a c t A collection of 110 isolates of Puccinia triticina in 2007 from different European wheat-growing regions were examined for their sensitivity to the demethylation inhibiting (DMI) fungicide epoxiconazole and the expression and mutations of the target gene, cyp51. The cyp51 gene was highly conserved across Europe. A mutation at codon 134 (Y134F) was identified in only five isolates. This mutation had a limited impact, if any, on the sensitivity of P. triticina towards epoxiconazole. Over the entire collection of isolates, cyp51 expression and in vitro sensitivity towards epoxiconazole was moderately correlated. A constitutive up-regulation of the cyp51 gene was detected in some of the isolates with higher ED 50 values. Such up-regulation was not inducible by exposure to different concentrations of epoxiconazole. Isolates of P. triticina with the highest ED 50 values and with the Y134F mutation in the cyp51 gene or with cyp51 overexpression were equally well controlled in vivo by registered field rates of epoxiconazole as compared to an isolate with the lowest ED 50 value

Integration of inertial MEMS sensors in active smart RFID labels for transport monitoring

The transport monitoring of sensitive and valuable goods requires, besides the storage of logistic data, the record of climate and ambient conditions. Therefore the acquisition of physical values like temperature, humidity, pressure, acceleration and inclination is necessary. Commercially available data logger devices are expensive and sizable. A cost effective alternative are active smart radio frequency identification (RFID) label containing microelectromechanical systems (MEMS). By integration of sensors, display and autonomous energy supply in a passive RFID label, wireless smart systems are created. However, the integration of MEMS into smart labels causes special requirements concerning power consumption and packaging. The power consumption of the system is limited due to the autonomous energy supply and so energy efficiency of the sensor is a key requirement. The special demands to the packaging are caused by the assembly of smart labels. The devices are integrated by flip chip bonding on an interposer, which is laminated between the capping layers of the label. Furthermore, usual roll to roll fabrication demands flexibility of the layers. This assembly technique limits the height of the components and hence, no additional housing of the chips is applicable. Therefore, wafer level packaging of the MEMS transducer providing hermetic sealing by minimizing chip geometry is necessary. For realizing a semi-active smart RFID label monitoring temperature, mechanical shock and inclination during transport processes, a MEMS based capacitive inertial sensor has been developed. For low energy consumption of the system sensor functionalities have been integrated and a low-power mixed-signal ASIC for sensor signal processing has been developed. Hermetic sealing of the microstructures has been done by seal glass bonding and a wafer level thin film encapsulation (TFE) technology based on CF-polymer as sacrificial layer material

4GOOD - Technology and prototype for a 4th-Generation Omni-purpose Optical Disc system

Digital optical data storage has become firmly established through CD, DVD and their derivatives. Future mobile and stationary multimedia applications demand for ever higher storage density, even beyond HD-DVD and Blu-ray Disc with 50 GB maximum storage capacity (dual layer). While holographic recording is in the far future for the consumer domain, the 4th generation of optical storage is being heralded by a leap in technology. Within a European initiative in the scope of the EUREKA project MobileDRIVE and the project 4GOOD (4th-Generation Omni-purpose Optical Disc-system), funded by the German Ministry of Economy and Technology, the fundamental technologies are being developed for high-density optical data storage (60... 100 Gbit/inch(2) in order to achieve at least 200 GB on a 12 cm disc, or e.g. > 5 GB on a 3 cm miniaturised version (single layer). The contribution describes the technology objectives, challenges, concepts and project status in the key areas of disc development, drive including laser, optics, acceleration sensors for mobile operation, and signal processing