52 research outputs found
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Strength of Si Wafers with Microcracks: A Theoretical Model; Preprint
This paper concentrates on the modeling of the strength of photovoltaic (PV) wafers. First a multimodal Weibull distribution is presented for the strength of a silicon specimen with bulk, surface, and edge imperfections. Next, a specific case is analyzed of a PV wafer with surface damage that takes the form of subsurface microcracks
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Strength of Si Wafers with Microcracks: A Theoretical Model (Poster)
A new analytical expression that takes into account the surface, edge, and bulk properties of a wafer has been proposed to describe the strength of the brittle materials. A new proposed fracture-mechanics numerical simulation successfully predicted the strength of the cast silicon wafers. It has been shown that the predicted wafer strength distribution agrees well with the available experimental results
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Dislocation Generation by Thermal Stresses in Si: Modeling and Experiments
We developed a finite-element modeling program to predict the thermally generated dislocation distribution in a wafer. This model uses measured parameters that are determined from generating dislocations under a known optical flux
Analyses of Failure Mechanisms and Residual Stresses in Graphite/Polyimide Composites Subjected to Shear Dominated Biaxial Loads
This research contributes to the understanding of macro- and micro-failure mechanisms in woven fabric polyimide matrix composites based on medium and high modulus graphite fibers tested under biaxial, shear dominated stress conditions over a temperature range of -50 C to 315 C. The goal of this research is also to provide a testing methodology for determining residual stress distributions in unidirectional, cross/ply and fabric graphite/polyimide composites using the concept of embedded metallic inclusions and X-ray diffraction (XRD) measurements
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Light-Induced Passivation of Si by Iodine Ethanol Solution: Preprint
We report on our observations of light-activated passivation of silicon surfaces by iodine-ethanol solution
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Wafer Preparation and Iodine-Ethanol-Ethanol Passivation Procedure for Reproducible Minority-Carrier Lifetime Measurement: Preprint
This paper describes reasons that lifetime measurments may be irreproducible using iodine-in-ethanol (I-E) passivation. Possible factors include the strength of the iodine in ethanol solution, wafer cleaning procedures, influence of wafer container during lifetime measurement, and stability of I-E
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Wafer Preparation and Iodine-Ethanol Passivation Procedure for Reproducible Minority-Carrier Lifetime Measurement (Poster)
Measurement of the bulk minority-carrier lifetime (T{sub b}) by optical methods, such as photocurrent decay or quasi-steady-state photoconductance (QSSPC), is strongly influenced by surface recombination. Several techniques are known to lower the effective surface recombination velocity, including the following: use of oxidation, floating N/P junction, SiN:H layer, HF immersion, and use of iodine in ethanol or methanol (I-E solution). Using I-E appears to be very simple and does not require any high-temperature treatment such as oxidation, diffusion, or nitridation processes, which can change T{sub b}. However, this is not a preferred procedure within the photovoltaic community because it is difficult to obtain same T{sub b} values reproducibly, particularly when the wafer lifetime is long. The objectives are: (1) Investigate various reasons why lifetime measurements may be irreproducible using I-E solution passivation. (2) Study the influence of the strength of iodine in the ethanol solution, wafer-cleaning procedures, influence of the wafer container during lifetime measurements, and the stability of I-E. (3) Compare lifetimes of wafers (having different T{sub b}) by various techniques such as QSSPC and transient photoconductive decay using short laser pulses of different light intensity; (4) Make minority-carrier diffusion length (L) measurements by a surface photovoltage technique, and to use T{sub b} and L data to determine diffusivity (D) values for various impurity and defect concentrations, using the relationship L{sup 2} = D* T{sub b}
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Studies on Backside Al-Contact Formation in Si Solar Cells: Fundamental Mechanisms; Preprint
This paper describes our investigations on the formation of back contacts in screen-printed solar cells, and how most requirements of a good back contact can be met by a suitable process
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