Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders

Presented work shows the results of DSC measurement for six Sn based solders. The alloys Sn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied in the temperature range from room temperature up to 400◦C. The transformation temperatures for melting as well as for solidification were influenced by the composition and thermal history of the alloys. The thermal history was altered by changing the maximum thermal cycle temperature and the heating/cooling rate. It is shown that the rate of solidification is far larger than that of the melting. The solidification rate is not influenced by neither the composition nor the thermal history of the material. Analysis of these results is presented

Influence of Manufacturing Mechanical and Thermal Histories on Dimensional Stabilities of FR4 Laminate and FR4/Cu-Plated Holes

Irreversible dimension changes of an FR4 laminate board in the z-direction and FR4 laminate/Cu plated holes that depend on their manufacturing histories have been studied by thermal mechanical analysis in the temperature range from room temperature to 240 °C. It is found that the compression residual stresses generated in both materials due to manufacturing pressing are released during heating, leading to an elongation in the specified direction. This increase depends on the composition of the studied composite and number of pressing cycles. The second reason for the observed dimensional changes is insufficient curing during manufacture that causes post-curing after the first heating cycle and related board shrinkage in the z-direction. The temperature regions of these two processes are not the same. The post-curing process occurs in the transition temperature range (near the glass transition temperature), whereas the release of the compression residual stress is observed at higher temperatures. Both these processes are temperature-dependent and do not proceed to completion during one heating cycle. Moreover, the compression residual stress strongly influences the post-curing process

Thermal Properties of Conducting Polypyrrole Nanotubes

Thermal properties of polypyrrole nanotubes synthesized by the chemical oxidation of pyrrole with iron(III) chloride in the presence of methyl orange as structure-guiding template, have been investigated. As-prepared polypyrrole salt and corresponding base were compressed into pellets. Thermogravimetric analysis has shown that the heating/cooling of both polymers is connected with water desorption/re-absorption. This process influences all temperature dependences of the thermophysical properties. The specific heat of both polypyrrole forms was the same at 35°C. The thermal diffusivity of polypyrrole base was lower than that of the salt. The dilatational characteristics are strongly influenced by water desorption/re-absorption. Water desorption is connected with the contraction of polypyrrole and its re-absorption with the expansion of polypyrrole. The electrical resistivity was measured, in analogy to thermal experiments, by a four-point van der Pauw method. The electrical resistivity was 0.016 and 10.2 Ωcm at room temperature, for both materials. The electrical resistivity was also influenced by water desorption/re-absorption as well as other thermophysical properties