Effect of laser loop on surface morphology of copper substrate and wettability of solder joint

The effect of different laser loop parameter on the geometry of micro-groove pattern on copper substrate and its effect on the wettability was investigated. The micro-grooves pattern was fabricated on the copper surface through laser surface texturing process. 3D measuring laser microscope and contact angle measurement test was conducted to measure the geometry of the micro-grooves pattern and wettability of the solder joint respectively. The results showed that the improvement in laser loop parameter increased the depth of the micro-grooves due to the more exposed time which allows more material ablation. It also showed that the contact angle of textured substrate is smaller than the untextured substrate which results in better wettability

Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy

This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart

Effect of LST parameter on surface morphology of modified copper substrates

This study aimed to investigate the effect of laser surface texturing (LST) parameter on the surface morphology of copper substrate. The results of different loop number (L1 to L5) on the resolidified material of micro-dimpled surface modified copper substrate were examined. The micro-dimple with a diameter of 100 μm was produced via LST process by varying the dimple distance at 100 μm and 180 μm. The resolidified material that was formed after the surface texturing process was analysed using 3D measuring laser microscope. Based on the data collected, the dimple was successfully engraved on the copper substrate. The increasing number of loop increase the quantity of the melted material which lead to higher amount of resolidified material and surface roughness

Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy

This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart