Networks of low-power CMOS neuromorphic neurons with robust neuromodulation capabilities for intelligent and adaptable neuromorphic systems

3. Good health and well-being9. Industry, innovation and infrastructur

Low-Cost Optical pH Sensor with a Polyaniline (PANI)-Sensitive Layer Based on Commercial Off-the-Shelf (COTS) Components

peer reviewedIn this paper, we presented a novel, compact, conceptually simple, and fully functional low-cost prototype of a pH sensor with a PANI thin film as a sensing layer. The PANI deposition process is truly low-cost; it performs from the liquid phase, does not required any specialized equipment, and comprises few processing steps. The resulting PANI layer has excellent stability, resistance to solvents, and bio- and chemical compatibility. The pH sensor’s sensing part includes only a few components such as a red-light-emitting diode (LED) as a light source, and a corresponding photodiode (PD) as a detector. Unlike other PANI-based sensors, it requires no sophisticated and expensive techniques and components such lasers to excite the PANI or spectrometry to identify the PANI color change induced by pH variation. The pH sensor is sensitive in the broad pH range of 3 to 9, which is useful for numerous practical applications. The sensor requires a tiny volume of the test specimen, as little as 55 µL. We developed a fully integrated packaging solution for the pH sensor that comprises a limited number of components. The pH sensor comprises exclusively commercial off-the-shelf (COTS) components and standard printed circuit boards. The pH sensor is assembled using standard surface mounting technology (SMT)

Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors

peer reviewedMetal-oxide (MOX) gas sensors commonly rely on custom packaging solution. With an ever-increasing demand for MOX gas sensors, there is a clear need for a low cost, compact and high-performance package. During normal operation, MOX sensors are heated up to a temperature in the typical range of 200-300°C. However, the generated heat must not damage or degrade any other part of the assembly. Using 3D finite elements modelling, we developed an optimal package configuration. To thermally insulate the assembly from the heated MOX sensor we have developed in-house a low thermal conductivity xerogel-epoxy composite with 22.7% by weight xerogel and a thermal conductivity of 107.9 mW m-1 K-1 which is a reduction exceeding 30% compared to commercially available epoxy. Based on the low thermal conductivity xerogel-epoxy composite, we have developed a novel packaging approach that can suit the large family of MOX sensors. The developed alternative packaging solution includes a small number of assembly steps and uses standard processes and techniques. The assembled MOX sensor is low cost and has a low power consumption, while all thermally sensitive assembly parts remain at low temperature during the system’s lifetime.Microsystème_ULg Microsys Project funded by Wallonia, Belgium; and in part by the MicroCProject co-funded by the European Regional Development Fund (ERDF), Wallonia, Belgium, under Grant 675781-642409

EMI insensitive reference current generation and distribution in an 8 bit current steering D/A converter in UMC 0.18 μm CMOS

peer reviewedThis paper describes the electromagnetic susceptibility of an 8 bit current steered thermometer encoded digital to analog converter (DAC) when electromagnetic interference (EMI) is injected into its bias current generator circuit. A theoretical analysis is presented and illustrates how the immunity to EMI can be increased by observing two fundamental design guidelines: these derivations are corroborated with simulations using the UMC 0.18 μm CMOS process. © 2011 Engineers Australia

Improved EMI filtering current mirror structure requiring reduced capacitance

The design of an improved current mirror is described, capable of filtering conducted electromagnetic interference without causing charge pumping. One of the major advantages of this structure lies in the reduced capacitance needed to realise the filter function, making this circuit perfectly suitable to use in an integrated environment

Measurement of EMI induced input offset voltage of an operational amplifier

An efficient measurement technique is introduced for determining the input referred offset voltage induced by electromagnetic interference (EMI) in operational amplifiers. © The Institution of Engineering and Technology 2007

A fundamental approach to EMI resistant folded cascode operational amplifier design

peer reviewedThis paper introduces four design guidelines targeted at improving the susceptibility of circuits to electromagnetic interference (EMI), and applies these to the practical design of folded cascode operational amplifier topologies with a high degree of immunity to conductive EMI injected in their input terminals. Simulations illustrate how an increased immunity to EMI can be obtained using the presented systematic approach. As will be shown, a modified recycling folded cascode topology exhibits an optimal immunity to EMI without overly sacrificing other design parameters. © 2013 EMC Europe Foundation

Increasing the EMI Immunity of CMOS Operational Amplifiers using an on-Chip Common-Mode Cancellation Circuit

peer reviewedThis paper presents an on-chip common-mode cancellation circuit which increases the common-mode rejection ratio (CMRR) in operational amplifiers, while at the same time increasing their immunity to electromagnetic interference (EMI). This common-mode cancellation circuit can be designed so as to double the differential gain while significantly reducing the common-mode gain. Simulations illustrate how the proposed amplifier exhibits an increased immunity to EMI injected in the opamp's inputs. A case study example shows that the maximum output offset voltage which is obtained when an EMI amplitude of 1 Vpp is injected in the noninverting input of a Miller amplifier connected as a voltage follower is equal to 50 mV and 200 mV with and without the common-mode cancellation structure respectively. Finally, simulations show that the common-mode deleting circuit is not overly sensitive to mismatch. © 2014 IEEE

EMI resisting CMOS differential pair structure

An improved differential pair structure, which is highly immune to conducted electromagnetic interference (EMI), is described. This new structure has a very low input offset voltage, even when a large EMI is superimposed on the nominal input signal. © The Institution of Engineering and Technology 2006