40,142 research outputs found

    Hawking Radiation of an Arbitrarily Accelerating Kinnersley Black Hole: Spin-Acceleration Coupling Effect

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    The Hawking radiation of Weyl neutrinos in an arbitrarily accelerating Kinnersley black hole is investigated by using a method of the generalized tortoise coordinate transformation. Both the location and temperature of the event horizon depend on the time and on the angles. They coincide with previous results, but the thermal radiation spectrum of massless spinor particles displays a kind of spin-acceleration coupling effect.Comment: 8 pages, no figure, revtex 4.0, revisted version with typesetting errors and misprint correcte

    Bagging evolutionary feature extraction algorithm for classification

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    Author name used in this publication: David ZhangBiometrics Research Centre, Department of ComputingVersion of RecordPublishe

    Tracers of chromospheric structure. I. CaII H&\&K emission distribution of 13000 F, G and K stars in SDSS DR7 spectroscopic sample

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    We present chromospheric activity index SHKS\rm_{HK} measurements for over 13,000 F, G and K disk stars with high signal-to-noise ratio (>> 60) spectra in the Sloan Digital Sky Survey (SDSS) Data Release 7 (DR7) spectroscopic sample. A parameter δ\deltaS is defined as the difference between SHKS\rm_{HK} and a `zero' emission line fitted by several of the most inactive stars. The SHKS\rm_{HK} indices of subgiant stars tend to be much lower than dwarfs, which provide a way to distinguish dwarfs and giants with relatively low resolution spectra. Cooler stars are generally more active and display a larger scatter than hotter stars. Stars associated with the thick disk are in general less active than those of the thin disk. The fraction of K dwarfs that are active drops with vertical distance from the Galactic plane. Metallicity affects SHKS\rm_{HK} measurements differently among F, G and K dwarfs in this sample. Using the open clusters NGC 2420, M67 and NGC6791 as calibrations, ages of most field stars in this SDSS sample range from 3-8 Gyr.Comment: 9 pages, 11 figures, AJ, 2013, 145, 14

    Non-existence of New Quantum Ergosphere Effect of a Vaidya-type Black Hole

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    Hawking evaporation of Dirac particles and scalar fields in a Vaidya-type black hole is investigated by the method of generalized tortoise coordinate transformation. It is shown that Hawking radiation of Dirac particles does not exist for P1,Q2P_1, Q_2 components but for P2,Q1P_2, Q_1 components in any Vaidya-type black holes. Both the location and the temperature of the event horizon change with time. The thermal radiation spectrum of Dirac particles is the same as that of Klein-Gordon particles. We demonstrates that there is no new quantum ergosphere effect in the thermal radiation of Dirac particles in any spherically symmetry black holes.Comment: Latex, 9 pages, no figure, submitted to Mod. Phys. Lett.

    Thermomechanical Characterization And Modeling For TSV Structures

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    Continual scaling of devices and on-chip wiring has brought significant challenges for materials and processes beyond the 32-nm technology node in microelectronics. Recently, three-dimensional (3-D) integration with through-silicon vias (TSVs) has emerged as an effective solution to meet the future technology requirements. Among others, thermo-mechanical reliability is a key concern for the development of TSV structures used in die stacking as 3-D interconnects. This paper presents experimental measurements of the thermal stresses in TSV structures and analyses of interfacial reliability. The micro-Raman measurements were made to characterize the local distribution of the near-surface stresses in Si around TSVs. On the other hand, the precision wafer curvature technique was employed to measure the average stress and deformation in the TSV structures subject to thermal cycling. To understand the elastic and plastic behavior of TSVs, the microstructural evolution of the Cu vias was analyzed using focused ion beam (FIB) and electron backscattering diffraction (EBSD) techniques. Furthermore, the impact of thermal stresses on interfacial reliability of TSV structures was investigated by a shear-lag cohesive zone model that predicts the critical temperatures and critical via diameters.Microelectronics Research Cente
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