DC Networks on the Distribution Level – New Trend or Vision?

"DC networks on Distribution Level – are they a new trend or a Vision?" That is the question that has focused the efforts of the Working Group the last two years, and whose consideration is summarized in this report. This report represents the first phase evaluation of this topic and is focused primarily on medium (MVDC) and low voltage (LVDC) level applications

Hazard study of MV switchgear with SF6 alternative gas in electrical room

International audienceThis study presents the risks generated by the use of the alternative gases to SF 6 for people working on medium voltage electrical equipment or close to these apparatus and the precautions to be taken in order to ensure the safety of people. The acute toxicity of fluoronitrile and fluoroketone being more important than the SF 6, more precautions must be taken in order to ensure the safety of people in case of gas leakage. On the other hand, the level of toxicity of HFO1234zeE is similar to SF6 and precautions to be taken are then same as for SF6

A 3D photonic-electronic integrated transponder aggregator with 48×16 heater control cells

An electronic integrated circuit (EIC) and a silicon photonic integrated circuit (PIC) are three-dimensional (3D)- integrated. The EIC using the complementary metal-oxide-semiconductor (CMOS) part of STMicroelectronics’ BCD8sp 0.16μm technology controls all 768 switches in the PIC individually and monitors them with 84 transimpedance amplifiers (TIAs). A scalable analog-digital approach with a cell size of 100×100μm² for thermal control of optical ring resonator switch matrices is introduced. An electrical power consumption of 220mW for all electronic control circuits of the optical swi tch matrix is resulting in 5.5% of the power needed by a constant-voltage control approach

Integrated, scalable and reconfigurable silicon photonics based optical switch for colorless, directionless and contentionless operation

We demonstrate a BCD8sP electronic-photonic integrated device for low cost, low power, and mass-manufacturable optical switching. Our network on-chip has one thousand photonic components, each driven by a dedicated electronic control circuit. The architecture implements a transponder aggregator scheme that manages 12 200GHz-spaced wavelengths in 4 different directions and 8 add/drop ports. The 3D integration of the photonic and the electronic chips allows the complete system reconfiguration at microsecond regime. The packaged device shows a total insertion loss of-22dB, including input and output coupling, and a channel isolation better than 35dB, in a device with a chip area of less than 1cm2

Design and Implementation of an Integrated Reconfigurable Silicon Photonics Switch Matrix in IRIS Project

This paper aims to present the design and the achieved results on a CMOS electronic and photonic integrated device for low cost, low power, transparent, mass-manufacturable optical switching. An unprecedented number of integrated photonic components (more than 1000), each individually electronically controlled, allows for the realization of a transponder aggregator device which interconnects up to eight transponders to a four direction colorless-directionless-contentionless ROADM. Each direction supports 12 200-GHz spaced wavelengths, which can be independently added or dropped from the network. An electronic ASIC, 3-D integrated on top of the photonic chip, controls the switch fabrics to allow a complete and microsecond fast reconfigurability