Microstructural dependence of the fracture toughness of metallic thin films: A bulge test and atomistic simulation study on single-crystalline and polycrystalline silver films

The microstructure contribution to the very low fracture toughness of freestanding metallic thin films was investigated by bulge fracture tests on 200-nm-thick {100} single-crystalline and polycrystalline silver films. The single-crystalline films exhibited a significantly lower fracture toughness value (KIC= 0.88 MPa m1/2) than their polycrystalline counterparts (KIC= 1.45 MPa m1/2), which was rationalized by the observation of an unusual crack initiation behavior—characterized by twinning in front of the notch tip—during in situ testing in the atomic force microscope. Twinning was also observed as a dominant deformation mechanism in atomistic simulations. This twinning tendency is explained by comparing the resolved shear stresses acting on the leading partial dislocation and the full dislocation, which allows to develop a size- and orientation-dependent twinning criterion. The fracture toughness of polycrystalline samples was found to be higher because of the energy dissipation associated with full dislocation plasticity and because of crack meandering along grain boundaries

Scaling of the fracture toughness of freestanding metallic thin films with the yield strength

The influence of the yield strength on the fracture toughness of freestanding metallic films with a thickness of ∼150 nm was investigated by bulge testing. For this purpose, gold films prepared by thermal evaporation were tested at room temperature and at 100°C. Additionally, different Au-Ag solid-solution strengthened films were studied. The fracture toughness of the films is observed to increase with increasing yield stress. This is at first sight counterintuitive but can be explained by previously observed severe necking leading to a chisel-point type of fracture in freestanding metallic thin films

Applicability of focused Ion beam (FIB) milling with gallium, neon, and xenon to the fracture toughness characterization of gold thin films

Focused ion beam (FIB) milling is an increasingly popular technique for fabricating micro-sized samples for nanomechanical characterization. Previous investigations have cautioned that exposure to a gallium ion beam can significantly alter the mechanical behavior of materials. In the present study, the effects of gallium, neon, and xenon ions are scrutinized. We demonstrate that fracture toughness measurements on freestanding gold thin films are unaffected by the choice of the ion species and milling parameters. This is likely because the crack initiation is controlled by the local microstructure and grain boundaries at the notch, rather than by the damaged area introduced by FIB milling. Additionally, gold is not susceptible to chemical embrittlement by common FIB ion species. This confirms the validity of microscale fracture measurements based on similar experimental designs.ISSN:0884-2914ISSN:2044-532