272 research outputs found
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In the work presented the potential of a pyrometric process control during laser beam soldering will be enhanced. Primarily we have developed a processing head with an integrated up-to-date pyrometric sensor conditioned for the temperature range of soft soldering. Using high speed photography we have analysed the detected secondary emissions during laser beam soldering and correlated the acquired pyrometric signals of process emissions with processes sequencing. Finally we named different strategies and control methods to achieve reliable high quality solder joints implementing a pyrometric process control
ΠΠΏΡΠ΅Π΄Π΅Π»Π΅Π½ΠΈΠ΅ Π΄Π΅ΡΠΎΡΠΌΠ°ΡΠΈΠΉ ΠΏΡΠΎΠ²ΠΎΠ΄Π° ΠΎΠ±ΠΌΠΎΡΠΎΠΊ ΡΡΠ°Π½ΡΡΠΎΡΠΌΠ°ΡΠΎΡΠ° ΡΠΎΠ±ΡΡΠ²Π΅Π½Π½ΡΠΌ ΠΌΠ°Π³Π½ΠΈΡΠ½ΡΠΌ ΠΏΠΎΠ»Π΅ΠΌ
ΠΡΠΈΠ²ΠΎΠ΄ΠΈΡΡΡ ΡΠ°ΡΡΠΌΠΎΡΡΠ΅Π½ΠΈΠ΅ ΠΏΡΠΎΠ΄ΠΎΠ»ΡΠ½ΡΡ
ΠΈ ΠΏΠΎΠΏΠ΅ΡΠ΅ΡΠ½ΡΡ
Π΄Π΅ΡΠΎΡΠΌΠ°ΡΠΈΠΉ ΠΏΡΠΎΠ²ΠΎΠ΄Π½ΠΈΠΊΠ° ΠΎΠ±ΠΌΠΎΡΠΊΠΈ ΡΡΠ°Π½ΡΡΠΎΡΠΌΠ°ΡΠΎΡΠ°, Π²ΡΠ·Π²Π°Π½Π½ΡΡ
ΡΠΎΠΊΠΎΠΌ ΠΊΠΎΡΠΎΡΠΊΠΎΠ³ΠΎ Π·Π°ΠΌΡΠΊΠ°Π½ΠΈΡ. ΠΡΠΈΠ²ΠΎΠ΄ΡΡΡΡ ΠΏΠΎΠ»Π΅Π·Π½ΡΠ΅ ΡΠΎΠΎΡΠ½ΠΎΡΠ΅Π½ΠΈΡ, ΠΏΠΎΠ·Π²ΠΎΠ»ΡΡΡΠΈΠ΅ ΠΎΡΠ΅Π½ΠΈΡΡ ΡΠ΄Π»ΠΈΠ½Π΅Π½ΠΈΡ ΠΈ ΡΠ΄Π²ΠΈΠ³ ΠΏΡΠΎΠ²ΠΎΠ΄Π½ΠΈΠΊΠΎΠ² Π² ΠΎΠ±ΠΌΠΎΡΠΊΠ΅ ΠΏΡΠΈ ΠΈΠ·Π²Π΅ΡΡΠ½ΠΎΠΌ ΡΠΎΠΊΠ΅. ΠΡΠΈΠ²ΠΎΠ΄ΠΈΡΡΡ ΠΏΡΠΈΠΌΠ΅Ρ ΡΠ°ΡΡΠ΅ΡΠ° ΡΠ°ΡΠΏΡΠ΅Π΄Π΅Π»Π΅Π½ΠΈΡ ΠΏΠΎΠ½Π΄Π΅ΡΠΎΠΌΠΎΡΠΎΡΠ½ΡΡ
ΡΠΈΠ» Π΄Π»Ρ ΠΏΡΠΎΠ²ΠΎΠ΄Π½ΠΈΠΊΠΎΠ² ΠΎΠ±ΠΌΠΎΡΠΊΠΈ ΡΡΠ°Π½ΡΡΠΎΡΠΌΠ°ΡΠΎΡΠ° ΠΊΡΡΠ³Π»ΠΎΠ³ΠΎ ΠΈ ΠΏΡΡΠΌΠΎΡΠ³ΠΎΠ»ΡΠ½ΠΎΠ³ΠΎ ΡΠ΅ΡΠ΅Π½ΠΈΡ
ΠΠ»ΠΈΡΠ½ΠΈΠ΅ ΠΎΡΠ½ΠΎΡΠΈΡΠ΅Π»ΡΠ½ΠΎΠΉ ΡΠΈΡΠΈΠ½Ρ Π·ΡΠ±ΡΠ°ΡΡΡ ΠΊΠΎΠ»Π΅Ρ Π½Π° ΠΎΠ±ΡΠ΅ΠΌ Π·ΡΠ±ΠΎΡΠ΅Π·Π½ΡΡ ΡΠ°Π±ΠΎΡ
In order to optimize the soldering process of laserbars onto heatsinks with Indium solder, several investigations have been made. First the growth of the Indium oxide film is examined. With this knowledge four different reduction methods are selected. Formic acid as a wet chemical reduction, a plasma activated Hydrogen/Argon gas, a gas enriched with formic acid, and a protective layer of Gold were investigated and compared for an optimized reduction of the oxide film of the Indium solder. A cross section of the solder interface after the soldering process is made in order to see the distribution of the metals. High diffusion of the solder with its contact partners is a sign of a good connection. Enough pure Indium has to be available after the soldering process in order to use its creek properties to reduce the mechanical stress in the laserbar
Π Π΅ΠΊΡΠΎΡ Π’ΠΠ Π. Π. ΠΠΎΡΠΎΠ±ΡΠ΅Π² - ΠΈΠ·ΠΎΠ±ΡΠ΅ΡΠ°ΡΠ΅Π»Ρ ΡΠ»Π΅ΠΊΡΡΠΎΠΈΠΌΠΏΡΠ»ΡΡΠ½ΠΎΠ³ΠΎ ΡΠΏΠΎΡΠΎΠ±Π° ΡΠ°Π·ΡΡΡΠ΅Π½ΠΈΡ Π³ΠΎΡΠ½ΡΡ ΠΏΠΎΡΠΎΠ΄
ΠΡΠ΅Π΄ΡΡΠ°Π²Π»Π΅Π½Π° ΠΈΡΡΠΎΡΠΈΡ ΡΠΎΠ·Π΄Π°Π½ΠΈΡ ΡΠ»Π΅ΠΊΡΡΠΎΠΈΠΌΠΏΡΠ»ΡΡΠ½ΠΎΠ³ΠΎ ΡΠΏΠΎΡΠΎΠ±Π° ΡΠ°Π·ΡΡΡΠ΅Π½ΠΈΡ Π³ΠΎΡΠ½ΡΡ
ΠΏΠΎΡΠΎΠ΄ ΡΠ΅ΠΊΡΠΎΡΠΎΠΌ Π’ΠΠ Π. Π. ΠΠΎΡΠΎΠ±ΡΠ΅Π²ΡΠΌ
Sustainable Campus Community Engagement
Laser metal deposition (LMD) was applied to deposit Inconel 718 metal matrix composites reinforced with TiC particles. The influence of laser energy input per unit length on constitution phases, microstructures, hardness, and wear performance of LMD-processed TiC/Inconel 718 composites was studied. It revealed that the LMD-processed composites consisted of Ξ³ Ni-Cr solid solution matrix, the intermetallic precipitation phase Ξ³β², and the TiC reinforcing phase. For the laser energy input per unit length of 80-120 kJ/m, a coherent interfacial layer with the thickness of 0.8-1.4 ΞΌm was formed between TiC reinforcing particles and the matrix, which was identified as (Ti,M)C (M=Nb and Mo) layer. Its formation was due to the reaction of the strong carbide-forming elements Nb and Mo of the matrix with the dissolved Ti and C on the surface of TiC particles. The microstructures of the TiC reinforcing phase experienced a successive change as laser energy input per unit length increased: Relatively coarsened poly-angular particles (80 kJ/m) - surface melted, smoothened TiC particles (β₯100 kJ/m) - fully melted/precipitated, significantly refined TiC dendrites/particles (160 kJ/m). Using the laser energy input per unit length β₯100 kJ/m produced the fully dense composites having the uniformly dispersed TiC reinforcing particles. Either the formation of reinforcement/matrix interfacial layer or the refinement in TiC dendrites/particles microstructures enhanced the microhardness and wear performance of TiC/Inconel 718 composites
Π Π½Π΅ΠΊΠΎΡΠΎΡΡΡ ΠΎΡΠΎΠ±Π΅Π½Π½ΠΎΡΡΡΡ ΡΡΡΡΠΊΡΡΡΡ ΡΡΠ°ΡΡΠΊΠΎΠ² ΠΊΠΎΡΡ Π²ΡΠ²Π΅ΡΡΠΈΠ²Π°Π½ΠΈΡ ΡΠ΅ΡΠΏΠ΅Π½ΡΠΈΠ½ΠΈΡΠΎΠ² ΠΠ΅ΠΌΠΏΠΈΡΡΠ°ΠΉΡΠΊΠΎΠ³ΠΎ ΠΌΠ°ΡΡΠΈΠ²Π°
New diode laser devices use the modular character of diode lasers to form beam shapes that are adapted to the processing task. In this paper cutting and welding applications of these tools are presented. A linear laser line is applied for the cutting-to-length of coil material. Diode laser modules that form an annular laser spot are utilized for optical flame cutting of steel material and simultaneous welding of annular seams. Furthermore, cutting of thin materials with a diode laser cutting plotter device is demonstrated. Moreover, new results of welding experiments with commercial diode lasers are presented
ΠΠ±ΡΠΈΠ΅ Π²ΠΎΠΏΡΠΎΡΡ ΡΠ°Π·Π²ΠΈΡΠΈΡ ΡΠ»Π΅ΠΊΡΡΠΎΠΏΡΠΈΠ²ΠΎΠ΄ΠΎΠ² ΡΠΎΠ²ΡΠ΅ΠΌΠ΅Π½Π½ΡΡ ΠΌΠ΅ΡΠ°Π»Π»ΠΎΡΠ΅ΠΆΡΡΠΈΡ ΡΡΠ°Π½ΠΊΠΎΠ²
Besides their high efficiency and compact dimensions high power diode laser systems feature the modularity to from different beam shapes adapted to the respective application. So apart from the development of diode laser systems concerning the increase of output power and beam quality, another approach is the special assembling of individual diode laser bars to build up modular systems for new direct diode applications. Despite the limited but often sufficient beam quality of this modular approach it offers many advantages in applications like simultaneous polymer welding, laser cutting, laser welding and hardening of metals
ΠΠ± ΠΎΠΏΡΠ΅Π΄Π΅Π»Π΅Π½ΠΈΠΈ ΠΎΠΏΡΠΈΠΌΠ°Π»ΡΠ½ΡΡ ΡΠ°ΡΡΡΠΎΡΠ½ΠΈΠΉ ΠΌΠ΅ΠΆΠ΄Ρ ΡΠ°Π·Π²Π΅Π΄ΠΎΡΠ½ΡΠΌΠΈ Π²ΡΡΠ°Π±ΠΎΡΠΊΠ°ΠΌΠΈ Π² ΡΠ²ΡΠ·ΠΈ Ρ ΡΠ°Π·Π»ΠΈΡΠ½ΡΠΌΠΈ ΡΠ°Π·ΠΌΠ΅ΡΠ°ΠΌΠΈ ΡΡΠ°ΡΡΠΊΠΎΠ² ΠΈ Π°Π½ΠΈΠ·ΠΎΡΡΠΎΠΏΠ½ΠΎΡΡΡΡ ΡΠ΅Π» ΠΏΠΎΠ»Π΅Π·Π½ΡΡ ΠΈΡΠΊΠΎΠΏΠ°Π΅ΠΌΡΡ
The main challenge to address single emitters in a high-power diode-laser-bar is the thermal and electrical management to avoid crosstalking. Especially p-side up assembly leads to increasing thermal influence of neighboring emitters due to the low thermal conductivity of GaAs. Electro-magnetic fields inside and outside the laser-bar, for example caused by high frequency modulation (10 MHz) at a high current (up to 1 A), induce voltages into neighboring electrical circuits, hence the output power of neighboring emitters can be affected
ΠΠ΅ΡΠΊΠΎΠ½ΡΠ°ΠΊΡΠ½ΡΠΉ ΠΎΠ΄Π½ΠΎΡΠ΅ΠΊΡΠΈΠΎΠ½Π½ΡΠΉ ΠΌΠΈΠΊΡΠΎΠ΄Π²ΠΈΠ³Π°ΡΠ΅Π»Ρ ΠΏΠΎΡΡΠΎΡΠ½Π½ΠΎΠ³ΠΎ ΡΠΎΠΊΠ°
Ultrafast lasers have found widespread applications in science and industry. In order to increase the throughput in micromachining and to reduce the measurement time in scientific applications, the average power of these laser sources needs to be increased. Ultrafast laser sources of high average power at moderate cost, high reliability and flexible repetition rate are essential for the transfer of femtosecond technology to industry
Π ΠΎΠ»Ρ Π΄ΠΈΠ·ΡΡΠ½ΠΊΡΠΈΠ²Π½ΡΡ Π½Π°ΡΡΡΠ΅Π½ΠΈΠΉ Π² ΡΠ°ΡΠΏΡΠ΅Π΄Π΅Π»Π΅Π½ΠΈΠΈ, ΡΠΎΡΠΌΠΈΡΠΎΠ²Π°Π½ΠΈΠΈ ΠΈ ΡΠ°Π·ΡΡΡΠ΅Π½ΠΈΠΈ Π·Π°Π»Π΅ΠΆΠ΅ΠΉ Π³Π°Π·Π° Π½Π° ΠΠ°Π»ΠΎΡ Π΅ΡΡΠΊΠΎΠΌ Π²Π°Π»Ρ (ΡΠ΅Π²Π΅ΡΠΎ-Π²ΠΎΡΡΠΎΠΊ ΠΠ°ΠΏΠ°Π΄Π½ΠΎ-Π‘ΠΈΠ±ΠΈΡΡΠΊΠΎΠΉ Π½ΠΈΠ·ΠΌΠ΅Π½Π½ΠΎΡΡΠΈ)
High reliable diode laser pump modules are essential for free-space optical telecommunications. Besides the reliability, low mass and small dimensions, radiation-hardness and low power-consumption are requirements to be met for space applications. A diode laser module suited for pumping Nd:YAG lasers for optical intersatellite links has been developed. The module consists of two diode laser bars overlaid by a polarization beam splitter to increase the system's reliability. Each diode laser bar consists of six emitters. If the integrated photodiode detects the failure of one bar, the second, substitute bar is switched on and can fully sustain all module functions. To equalize the beam quality of the diode laser bar, a pair of micro step mirrors is used for each bar. The laser beam is focussed on the entrance of a d=200 Β΅m, NA=0.22 fiber. Both the coupling efficiency and the accuracy of the mounting of the diode laser components have been analyzed by raytracing. Passive cooling has been chosen because liquid chilling systems are unsuitable for space applications. To evaluate the effects of different heat sink materials and to predict the temperature drop over the module, a 3D finite element analysis for the steady-state temperature distribution of the module has been performed. The optical output power of the module described above amounts to 2,8 W with one bar operating derated to 0.5x maximum current, and the whole unit fits in a housing of 78 x 50 x 24 mm. Further developments will lead to a more compact design and a smaller fiber diameter
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