168 research outputs found
Heat Transport across Interfaces for the Optimization of Heat Sinking in Device Applications
Heterogenous integration of materials and devices opens huge opportunities for exploiting device structures which benefit from an optimal combination of electronic and thermal material properties. It is critically important to assess heat transfer across their interfaces to avoid thermal bottlenecks resulting in excessive device temperatures though. Experimental techniques to assess thermal conductivity of materials and thermal boundary resistance between materials are reviewed, with examples from GaN-on-Diamond, diamond to metal diamond composites
Solid immersion lenses for enhancing the optical resolution of thermal and electroluminescence mapping of GaN-on-SiC transistors
A Review of Raman Thermography for Electronic and Opto-Electronic Device Measurement With Submicron Spatial and Nanosecond Temporal Resolution
Time Resolved Hyperspectral Quantum Rod Thermography of Microelectronic Devices:Temperature Transients in a GaN HEMT
Thermal properties of AlGaN/GaN high electron mobility transistors on 4H and 6H SiC substrates
Transient thermoreflectance for device temperature assessment in pulsed-operated GaN-based HEMTs
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