10 research outputs found

    Room Temperature Oxidation of Al-Cu-Fe and Al-Cu-Fe-Cr Quasicrystals

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    We have investigated formation of oxides on quasicrystalline and crystalline alloy surfaces of similar composition, in different oxidizing environments. This includes a comparison between a quaternary orthorhombic approximate of Al-Cu-Fe-Cr quasicrystal and the ternary Al-Cu-Fe quasicrystalline and crystalline phases. We noted that each sample showed the following common trends: preferential oxidation of the Al, enrichment in the concentration of Al present at the surface upon oxidation, water concentration is directly related to oxide thickness, and the oxide thickness displays a strong correlation with the bulk concentration of Al in the sample

    Room Temperature Oxidation of Al-Cu-Fe and Al-Cu-Fe-Cr Quasicrystals

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    We have investigated formation of oxides on quasicrystalline and crystalline alloy surfaces of similar composition, in different oxidizing environments. This includes a comparison between a quaternary orthorhombic approximate of Al-Cu-Fe-Cr quasicrystal and the ternary Al-Cu-Fe quasicrystalline and crystalline phases. We noted that each sample showed the following common trends: preferential oxidation of the Al, enrichment in the concentration of Al present at the surface upon oxidation, water concentration is directly related to oxide thickness, and the oxide thickness displays a strong correlation with the bulk concentration of Al in the sample.This article is from Quasicrystals: Proceedings of the MRS 1998 Fall Meeting 553 (1999): pp. 263—268, doi:10.1557/PROC-553-263</p

    Electrochemical Pitting And Repassivation On Icosahedral AL-CU-FE, And A Comparison With Crystalline Phases

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    We report the electrochemical potentials at which localized pitting and repassivation occur on icosahedral Al-Cu-Fe, and on a series of related alloys and elemental metals. The electrochemistry occurs in a buffered NaCI solution, pH 8.4. Under these conditions, pitting and repassivation appear to be controlled mainly by the chemical composition of the alloy, although the quasicrystalline phase displays an anomalous resistance to repassivation. Corrosion of this phase proceeds by dissolution of Al and Fe, leaving behind pits which are Cu-enriched.This article is from Quasicrystals: Proceedings of the MRS 1998 Fall Meeting 553 (1999): pp. 275—280, doi:10.1557/PROC-553-275</p

    Surface Oxidation of Al-Pd-Mn and Al-Cu-Fe Alloys

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    The application of ultrahigh vacuum surface analytical techniques to the study of the oxidation of Al-Pd-Mn and Al-Cu-Fe quasicrystals is presented. Comparisons of the effects of various oxidation environments are made for each material as well as for a cubic phase of Al-Pd-Mn. We find that the oxidation of the two icosahedral alloys is similar. Exposure to oxygen in vacuum, normal air, humid air and immersion in water represent progressively better oxidizing environments, resulting in increasingly deeper oxides. Oxidation of Al occurs most readily, but oxidation of other metals also becomes apparent upon going from oxygen in vacuum to immersion in water; which also attests to the effectiveness of water as an oxidant. Oxide thicknesses for both quasicrystalline alloys are comparable for each oxidation environments. Comparison of quasicrystalline to cubic Al-Pd-Mn shows that the cubic phase is more readily oxidized. In addition, while the surfaces of both quasicrystalline alloys become significantly enriched in Al upon oxidation, such enrichment is not observed for the cubic alloy. This suggests that the structure of quasicrystals plays an important role in their oxidation chemistry.This article is from Proceedings of the Conference on New Horizons in Quasicrystals: Research and Application (1997): pp. 157—164</p

    Electrodeposition of Copper for Three-Dimensional Metamaterial Fabrication

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    Metamaterials typically consist of metallic and dielectric repeating structures. Electrodeposition of copper is the preferred approach to fabricating the metallic part of the metamaterials of interest in this study. The highly variant topography requires chemical additives, like chloride ions, 3-mercapto-1-propanesulfonic acid (MPSA), polyethylene glycol (PEG), and polyvinylpyrrolidone (PVP) to enhance bottom-up superfilling while maintaining terrace flatness. This study focuses on both experimental and computational investigations of the degradation potential of the additives and their adsorption mechanism in a highly acidic copper electrolyte in order to optimally parametrize the copper electrodeposition process. Results show Cl–MPSA–PEG–PVP additives perform well, but substitution of PVP with Janus Green B provides better terrace leveling. Additionally, NMR data show a quick and complete conversion of MPSA to bis­(3-sulfopropyl) disulfide (SPS) in the acidic copper bath. Finally, FEM simulations further show that the accelerator species may initially accumulate and be transported vertically until overplating, whereby they are transported laterally
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