16 research outputs found
Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics
Simulation of heat transfer by cooling channels in LTCC substrate
The thermal resistance, flow analysis, pressure drop and distribution of coolant inside multilayer LTCC (Low Temperature Co-fired Ceramics) substrate are detailed investigated in this paper. For this reason four various structures of internal channels in the multilayer LTCC substrates were designed and simulated. The simulation 3D model consist of 6 LTCC of DuPont 951® layer with cooling microchannel in middle of substrate, power chips paced on top of LTCC and silver sintered joints under power chips. The impact of the structure of channels, volume flow and power loss of die was simulated, calculated and analyzed by using the simulation software Mentor Graphics FloEFDTM. The structure and size of channels have the significant impact on thermal resistance, pressure of coolant as well as the effectivity of cooling power components which can be placed on LTCC substrate. The thermal resistance was calculated from the temperature gradient among chip junction, the inlet fluid and the thermal load of chip. Optimizing and comparison of cooling channels structure inside LTCC substrates and analyzing the effect of volume flow for
achieving the least thermal resistance of LTCC multilayer substrate is the main contribution of this paper
Dependence of electrical resistivity on sintering conditions of silver layers printed by InkJet printing technology
Influence of Various Technologies on the Quality of Ultra-Wideband Antenna on a Polymeric Substrate
The design, simulation, realization, and measurement of an ultra-wideband (UWB) antenna on a polymeric substrate have been realized. The UWB antenna was prepared using conventional technology, such as copper etching; inkjet printing, which is regarded as a modern and progressive nano-technology; and polymer thick-film technology in the context of screen-printing technology. The thick-film technology-based UWB antenna has a bandwidth of 3.8 GHz, with a central frequency of 9 GHz, and a frequency range of 6.6 to 10.4 GHz. In addition to a comparison of the technologies described, the results show that the mesh of the screens has a significant impact on the quality of the UWB antenna when utilizing polymeric screen-printing pastes. Last but not least, the eco-friendly combination of polyimide substrate and graphene-based screen-printing paste is thoroughly detailed. From 5 to 9.42 GHz, the graphene-based UWB antenna achieved a bandwidth of 4.42 GHz. The designed and realized UWB antenna well exceeds the Federal Communications Commission’s (FCC) standards for UWB antenna definition. The modification of the energy surface of the polyimide substrate by plasma treatment is also explained in this paper, in addition to the many types of screen-printing pastes and technologies. According to the findings, plasma treatment improved the bandwidth of UWB antennas to 5.45 GHz, and the combination of plasma treatment with graphene provides a suitable replacement for traditional etching technologies. The characteristics of graphene-based pastes can also be altered by plasma treatment in terms of their usability on flexible substrates