Energy recovery methodology in industrial processes

International audienceThrough the CERES -2 project, supported by the French Research National Agency (ANR), we have developed an open source software platform, called CERES, to optimize heat recovery in continuous industrial processes. This platform is based on a multi-scale and multi critera methodology for heat recovery optimisation. This methodology is based on the following calculation steps:1. Minimum Energy Requirement identification2. Minimum Exergy Requirement and utilities identification3. Exchanger network constructionAt each step we solve a linear mono-objective problem. The first step allows, from a set of heat flows, to build the composite curves and to determine the minimum heating and cooling energy requirements. With the set of heat flows and a solution of the first step, the second step proposes the introduction of utilities, such as heat pumps or organic Rankine cycle (ORC), to minimize the exergy destruction. The last step is based on an algorithm of heat exchanger network design (HEN) including utilities and heat recovery technologies sizing, based on economic criteria. The set of heat flows are constructed in the platform CERES from industrial processes Modelica models. CERES has been validated with 3 industrial case studies

Case study of energy recovery in workshops using induction heating systems

International audienceThe aim of this study is to improve the energy efficiency of an industrial process including an induction heating device by recovering fatal losses coming either from inductor Joule losses or from heated pieces after treatment. Software tool based on the pinch method was developed in Modelica language. A specific model for the induction heating device was written, taking into account the temperature dependence of the thermal properties of the heated metal and of the heating efficiency of the induction device. The collected energy can be reused in relay of a boiler inside the process line for heating pickling baths or washing baths or for space heating or domestic hot water production. It can also be converted into electricity (Organic Rankine Cycle, thermoelectricity). In this paper, the authors present case studies realized in a typical steel forging workshop and in a cast iron foundry. They show that direct reuse of the thermal energy has a payback around 3 years. It requires a coil cooling circuit at high temperature (typically 70 to 300 °C). The conversion into electricity is not relevant because of a very long payback

An improved mobility model for FDSOI TriGate and other multi-gate Nanowire MOSFETs down to nanometer-scaled dimensions

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Transport in TriGate nanowire FET: Cross-section effect at the nanometer scale

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High and low-field contact Resistances in Trigate Devices in a Non-Equilibrium Green's Functions Framework

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Performance & reliability of 3D architectures (πfet, Finfet, Ωfet)

session 6F: Process IntegrationInternational audienceThe impact of 3D architectures and boosters on the trade-off performance/reliability is deeply investigated in this paper. “Finfet” transistor presents a slight superior trade-off than square shaped “πfet” device because of little improved performance and similar BTI&HC reliability. “Ωfet” also offers a better compromise than πfet due to improved BTI reliability. Finally strained SOI & SiGeOI devices are highly suitable since they allow boosting the transistor performance without any reliability penalty

2D TCAD strain simulations from fully depleted to nanowire transistors: efficiency of mechanical stressors

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Study of the piezoresistive properties of NMOS and PMOS Ω-gate SOI nanowire transistors: Scalability effects and high stress level

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Mechanical simulation of stress engineering solutions in highly strained p-type FDSOI MOSFETs for 14-nm node and beyond

International audienceStress engineering is a powerful tool to enhance nanoscale device performances. In this study we developed a methodology of 14nm strained pMOS FDSOI device mechanical simulation in order to carefully evaluate different stress effects on device performances. Mechanical simulation results are presented for different process solutions, such as Gate-First (GF) and Gate-Last (GL) processes but also for variation of germanium contents in source/drain and channel regions