High-temperature thin-film barriers for foldable AMOLED displays

\u3cp\u3eWe present a thin-film dual-layer bottom barrier on polyimide that is compatible with 350°C backplane processing for organic light-emitting diode displays and that can facilitate foldable active-matrix organic light-emitting diode devices with a bending radius of <2 mm. We demonstrate organic light-emitting diodes that survive bending over 0.5 mm radius for 10.000× based on the high-temperature bottom barrier. Furthermore, we show compatibility of the bottom barrier with the backplane process by fabricating active-matrix organic light-emitting diode displays on GEN1-sized substrates.\u3c/p\u3

High-temperature thin-film barriers for foldable AMOLED displays

We present a thin-film dual-layer bottom barrier on polyimide that is compatible with 350°C backplane processing for organic light-emitting diode displays and that can facilitate foldable active-matrix organic light-emitting diode devices with a bending radius of <2 mm. We demonstrate organic light-emitting diodes that survive bending over 0.5 mm radius for 10.000× based on the high-temperature bottom barrier. Furthermore, we show compatibility of the bottom barrier with the backplane process by fabricating active-matrix organic light-emitting diode displays on GEN1-sized substrates

Dual-gate self-aligned IGZO TFTs monolithically integrated with high-temperature bottom moisture barrier for flexible AMOLED

\u3cp\u3eWe present a 350°C self-aligned dual-gate a-IGZO backplane technology with a monolithically integrated multi-layer high-temperature thin-film barrier for flexible AMOLED. Thin-film barrier properties and TFT technology are optimized on 320 x 352mm substrates, and demonstrated in a flexible QQVGA 100 ppi AMOLED display prototype.\u3c/p\u3