Self-assembled titanium-based macrostructures with hierarchical (macro-, micro-, and nano) porosities : a fundamental study

This study details the novel self-assembly of sodium titanate converted Ti-based microspheres into hierarchical porous 3D constructs, with macro-, micro-, and nanoporosity, for the first time. Ti6Al4V microspheres were suspended into 5 M NaOH (60 °C/24 h) solutions, with extensive variations in microsphere:solution ratios to modify microsphere interaction and initiate self-assembly through proximity merging of titanate surface dendritic growth. The formed structures, which either produced 1) unbonded, sodium titanate-converted microspheres; 2) flat (non-macroporous) scaffolds; or 3) open, hierarchically porous scaffolds, were then assessed in terms of their formation mechanism, chemical composition, porosity, as well as the effect of post-heat treatments on compressive mechanical properties. It was found that specific microsphere:solution ratios tended to form certain structures (3 flat non-macroporous, >8 powder) due to a combination of microsphere freedom of movement, H2 gas bubble formation, and exposed surface reactivity. This promising discovery highlights the potential for lower temperature, simplistic production of 3D constructs with modifiable chemical properties due to the ion-exchange potential of titanate structures, with clear applications in a wide-range of fields, from medical materials to catalysts

Self-assembled titanium-based macrostructures with hierarchical (macro-, micro-, and nano) porosities: A fundamental study

This study details the novel self-assembly of sodium titanate converted Ti-based microspheres into hierarchical porous 3D constructs, with macro-, micro-, and nanoporosity, for the first time. Ti6Al4V microspheres were suspended into 5 M NaOH (60 °C/24 h) solutions, with extensive variations in microsphere:solution ratios to modify microsphere interaction and initiate self-assembly through proximity merging of titanate surface dendritic growth. The formed structures, which either produced 1) unbonded, sodium titanate-converted microspheres; 2) flat (non-macroporous) scaffolds; or 3) open, hierarchically porous scaffolds, were then assessed in terms of their formation mechanism, chemical composition, porosity, as well as the effect of post-heat treatments on compressive mechanical properties. It was found that specific microsphere:solution ratios tended to form certain structures (3 flat non-macroporous, >8 powder) due to a combination of microsphere freedom of movement, H2 gas bubble formation, and exposed surface reactivity. This promising discovery highlights the potential for lower temperature, simplistic production of 3D constructs with modifiable chemical properties due to the ion-exchange potential of titanate structures, with clear applications in a wide-range of fields, from medical materials to catalysts

Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment

Both real Si insulated gate bipolar transistors (IGBT) with conventional Ni\Ag metallization and a dummy Si die with thickened Ni\Ag metallization have been bonded on Ag foils electroplated with 2.7 m and 6.8 m thick Sn as an interlayer at 250ºC for 0 min, 40 min and 640 min. From microstructure characterization of the resulting joints, suitable thicknesses are suggested for the Ag base metal and the Sn interlayer for Ag/Sn/Ag transient liquid phase (TLP) joints used in power die attachment, and the diffusivities of Ag and Sn in the Ag phase are extracted. In combination with the kinetic constants of Ag3Sn growth and diffusivities of Ag and Sn in Ag reported in the literature, the extracted diffusivities of Ag and Sn in Ag phase are also used to simulate and predict the diffusion-controlled growth and evolution of phases in the Ag/Sn/Ag TLP joints during an extended bonding process and in service

Characterization and solderability of cold sprayed Sn-Cu coatings on Al and Cu substrates

Cold sprayed Sn-Cu coatings approximately 40 and 25 μm in average thickness were deposited on aluminium and direct bonded copper (DBC) substrates respectively. Both a statistical analysis of coating thickness and a roughness analysis of the coating/substrate interface and the coating surface were carried out for the as-sprayed coatings using scanning electron microscope images. The results obtained can be related to substrate types and spraying conditions. Tin oxide on the surfaces of the as-sprayed coatings was revealed by employing X-ray photoelectron spectroscopy analyses and transmission electron microscopy. It came from an oxide shell around feedstock powder particles and was only locally broken down during cold spraying. Although the tin oxide inhibited fluxless soldering, flux-supported reflow of cold sprayed Sn on the DBC substrate produced Cu/Sn/Cu solder joints that were acceptable for application in electronic packaging and interconnects. In general, measures which can avoid or remove the tin oxide are needed to achieve improved solder joints using cold sprayed Sn coatings as the solder layers