How 3D integration technologies enable advanced compute node for Exascale-level High Performance Computing?

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POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems

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Benefits of design assist techniques on performances and reliability of a RRAM macro

International audienceThis paper presents different design assist techniques and demonstrates their impact on enhancing the intrinsic RRAM performance. We show that the read-beforewrite, current-limitation and write-termination techniques reduce by-47%,-56% and-13% the power consumption during the writing process, respectively. Combined with write verification and error correction code, the overall improvements are 87% in energy saving and-55% on access time. Based on representative RRAM macro (130nm CMOS), statistic (128kb) and endurance (1M cycles) characterizations, this works contributes to accelerate RRAM industrial adoption by highlighting the design-technology co-optimization contribution

Material and integration challenges for large scale Si quantum computing

International audienceSi spin qubits are very promising to enable large scale quantum computing as they are fast, of high quality and small. However, they are still lagging behind in terms of number of qubits. Indeed there are material and integration challenges to be tackled before fully expressing their potential

Towards scalable quantum computing based on silicon spin

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Challenges and perspectives in the modeling of spin qubits

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