Void-induced cross slip of screw dislocations in fcc copper

Pinning interaction between a screw dislocation and a void in fcc copper is investigated by means of molecular dynamics simulation. A screw dislocation bows out to undergo depinning on the original glide plane at low temperatures, where the behavior of the depinning stress is consistent with that obtained by a continuum model. If the temperature is higher than 300 K, the motion of a screw dislocation is no longer restricted to a single glide plane due to cross slip on the void surface. Several depinning mechanisms that involve multiple glide planes are found. In particular, a depinning mechanism that produces an intrinsic prismatic loop is found. We show that these complex depinning mechanisms significantly increase the depinning stress

Characteristics of the interaction of Cu-rich precipitates with irradiation-produced defects in α-Fe

The interaction between copper-rich precipitates in �-iron and either vacancies or self-interstitial atoms and their clusters is studied by atomic-scale modelling. Results are compared with predictions of elasticity theory and interpreted in terms of size misfit of precipitates and defects, and the modulus and cohesive energy differences between iron and copper. Interstitial defects are repelled by precipitates at large distance but, like vacancies, attracted at small distance. Hence, copper precipitates in iron can be sinks for both vacancy and interstitial defects, and can act as strong recombination centres under irradiation conditions. This leads to a tentative explanation for the mixed Cu–Fe structure of precipitates and the absence of precipitate growth under neutron irradiation conditions. More generally, both vacancy and interstitial defects may be strongly bound to precipitates with weaker cohesion than the matrix