Interfacial Intermetallic Growth and Strength of Composite Lead-Free Solder Alloy Through Isothermal Aging

The effects of particle reinforcement of Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) lead-free solder on interfacial intermetallic layer growth and strength of the ensuing joints through short-term isothermal aging (150°C) were studied. Composite solders were prepared by either incorporating 2wt.% Cu (3μm to 20μm) or Cu2O (∼150nm) particles into SAC405 paste. Aggressive flux had the effect of reducing the Cu2O nanoparticles into metallic Cu which subsequently reacted with the solder alloy to form the Cu6Sn5 intermetallic. While all solders had similar interfacial intermetallic growth upon reflow, both of the composite solders' growth rates slowed through aging to reach a common growth rate exponent of approximately 0.38, considerably lower than that of the nonreinforced solder (n=0.58). The nanoscale reinforced solder additionally exhibited the highest tensile strength in both the initial and aged conditions, behavior also attributed to its quick conversion to a stable microstructur

Yang-Lee and Fisher Zeros of Multisite Interaction Ising Models on the Cayley-type Lattices

A general analytical formula for recurrence relations of multisite interaction Ising models in an external magnetic field on the Cayley-type lattices is derived. Using the theory of complex analytical dynamics on the Riemann sphere, a numerical algorithm to obtain Yang-Lee and Fisher zeros of the models is developed. It is shown that the sets of Yang-Lee and Fisher zeros are almost always fractals, that could be associated with Mandelbrot-like sets on the complex magnetic field and temperature planes respectively.Comment: 9 pages, 3 figures; with minor correction

Agarose cell block technique as a complementary method in the diagnosis of fungal osteomyelitis in a dog

A 7-year-old Labrador Retriever female dog presenting left forelimb lameness for one day was admitted to the Veterinary Hospital (UNESP-Botucatu) for clinical evaluation. Several tests, including blood and image analysis, microbiological culture and cytology of lytic areas of affected bone were made in order to establish a diagnosis. Serum biochemical profile revealed increased levels of liver enzymes, plasma globulin, creatine kinase (CK) and calcium. Hemogram revealed anemia and leukocytosis; left humerus image analysis revealed an osteolytic lesion and cytology revealed a suppurative periostitis. Differential diagnosis was a nonspecific infectious inflammatory process or osteosarcoma. Since it was not possible to achieve a definitive diagnosis and there was a highly suspicious for an infectious agent, an agarose cell block of the bone marrow fine-needle aspiration was made. The cytological examination of cell block presented similar findings as described previously. However, additional stains including periodic acid-Schiff (PAS) were positive for fungal hyphae, which rendered a diagnosis of fungal osteomyelitis due to Aspergillus spp. This case report illustrates an uncommon cause of osteomyelitis for breed that was diagnosed by an underused method in veterinary medicine

Understanding of void formation in Cu/Sn-Sn/Cu system during transient liquid phase bonding process through diffusion modeling

Transient Liquid Phase (TPL) bounding of Sn foil sandwiched between two Cu foils involves, in the temperature range above the melting point of Sn (232 °C) and below 350 °C, the formation and the growth of two intermetallic compounds (IMCs) Cu6Sn5 and Cu3Sn and mostly unintended micro-pores. The present study aims to analyze the mechanism of void development during the soldering process through an experimental and modeling approach of diffusion-controlled IMC transformation. This modeling couples the diffusion process and the interface motion with the volume shrinkage induced by the difference of partial molar volumes of atoms between each phase. We also consider two types of inter-diffusion transports: (i) inter-diffusion based on the exchange of Cu and Sn atoms and (ii) inter-diffusion of Sn atoms with vacancies allowing Kirkendall void formation. The simulations of IMC growth performed correspond to a sequence of planar phase layers, where the distinctive scallop morphology of the Cu6Sn5 layer is described through an analytical function allowing to quantify the grain boundary diffusion pathway. We take into account of the volume diffusion mechanism for Cu3Sn intermetallic. For Cu6Sn5 intermetallic two mechanisms are considered, volume diffusion and grain boundary diffusion, limited by grain growth. The simulations of IMC growth kinetics, for different transport scenarios, are compared to the experimental evolving morphologies to determine the most likely mechanism of micro-void formation