Design, analysis, and test verification of advanced encapsulation systems

Design sensitivities are established for the development of photovoltaic module criteria and the definition of needed research tasks. The program consists of three phases. In Phase I, analytical models were developed to perform optical, thermal, electrical, and structural analyses on candidate encapsulation systems. From these analyses several candidate systems will be selected for qualification testing during Phase II. Additionally, during Phase II, test specimens of various types will be constructed and tested to determine the validity of the analysis methodology developed in Phase I. In Phse III, a finalized optimum design based on knowledge gained in Phase I and II will be developed. All verification testing was completed during this period. Preliminary results and observations are discussed. Descriptions of the thermal, thermal structural, and structural deflection test setups are included

High resolution, low cost solar cell contact development

The MIDFILM cell fabrication and encapsulation processes were demonstrated as a means of applying low-cost solar cell collector metallization. The average cell efficiency of 12.0 percent (AM1, 28 C) was achieved with fritted silver metallization with a demonstration run of 500 starting wafers. A 98 percent mechanical yield and 80 percent electrical yield were achieved through the MIDFILM process. High series resistance was responsible for over 90 percent of the electrical failures and was the major factor causing the low average cell efficiency. Environmental evaluations suggest that the MIDFILM cells do not degrade. A slight degradation in power was experienced in the MIDFILM minimodules when the AMP Solarlok connector delaminated during the environmental testing

High resolution, low cost solar cell contact development

The experimental work demonstrating the feasibility of the MIDFILM process as a low cost means of applying solar cell collector metallization as reported. Cell efficiencies of above 14% (AMl, 28 C) were achieved with fritted silver metallization. Environmental tests suggest that the metallization is slightly humidity sensitive and degradation is observed on cells with high series resistance. The major yield loss in the fabrication of cells was due to discontinuous grid lines, resulting in high series resitance. Standard lead-tin solder plated interconnections do not appear compatible with the MIDFILM contact. Copper, nickel and molybdemun base powder were investigated as low cost metallization systems. The copper based powder degraded the cell response. The nickel and molybdenum base powders oxidized when sintered in the oxidizing atmosphere necessary to ash the photoresin

Investigation of proposed process sequence for the array automated assembly task, phases 1 and 2

Progress was made on the process sequence for module fabrication. A shift from bonding with a conformal coating to laminating with ethylene vinyl acetate and a glass superstrate is recommended for further module fabrication. The processes that were retained for the selected process sequence, spin-on diffusion, print and fire aluminum p+ back, clean, print and fire silver front contact and apply tin pad to aluminum back, were evaluated for their cost contribution

Structure of deformed silicon and implications for low cost solar cells

The microstructure and minority carrier lifetime of silicon were investigated in uniaxially compressed silicon samples. The objective of the investigation was to determine if it is feasible to produce silicon solar cells from sheet formed by high temperature rolling. The initial structure of the silicon samples ranged from single crystal to fine-grained polycrystals. The samples had been deformed at strain rates of 0.1 to 8.5/sec and temperatures of 1270-1380 C with subsequent annealing at 1270-1380 C. The results suggest that high temperature rolling of silicon to produce sheet for cells of high efficiency is not practical

Mars Orbiter Sample Return Power Design

Mars has greatly intrigued scientists and the general public for many years because, of all the planets, its environment is most like Earth's. Many scientists believe that Mars once had running water, although surface water is gone today. The planet is very cold with a very thin atmosphere consisting mainly of CO2. Mariner 4, 6, and 7 explored the planet in flybys in the 1960s and by the orbiting Mariner 9 in 1971. NASA then mounted the ambitious Viking mission, which launched two orbiters and two landers to the planet in 1975. The landers found ambiguous evidence of life. Mars Pathfinder landed on the planet on July 4, 1997, delivering a mobile robot rover that demonstrated exploration of the local surface environment. Mars Global Surveyor is creating a highest-resolution map of the planet's surface. These prior and current missions to Mars have paved the way for a complex Mars Sample Return mission planned for 2003 and 2005. Returning surface samples from Mars will necessitate retrieval of material from Mars orbit. Sample mass and orbit are restricted to the launch capability of the Mars Ascent Vehicle. A small sample canister having a mass less than 4 kg and diameter of less than 16 cm will spend from three to seven years in a 600 km orbit waiting for retrieval by a second spacecraft consisting of an orbiter equipped with a sample canister retrieval system, and a Earth Entry Vehicle. To allow rapid detection of the on-orbit canister, rendezvous, and collection of the samples, the canister will have a tracking beacon powered by a surface mounted solar array. The canister must communicate using RF transmission with the recovery vehicle that will be coming in 2006 or 2009 to retrieve the canister. This paper considers the aspect and conclusion that went into the design of the power system that achieves the maximum power with the minimum risk. The power output for the spherical orbiting canister was modeled and plotted in various views of the orbit by the Satellite Orbit Analysis Program (SOAP)

Array Automated Assembly, Phase 2

The baseline process sequence using nontextured square wafers was integrated. Difficulties encountered include: (1) replacement of the N-250 spray on diffusion source with PX-10 source; and (2) modification of the firing for printed silver and aluminum contracts is required to accommodate the change of wafer size and shape. Results indicate that the cells processed through the entire process sequence except laser scribe and spray on AR coating indicate the process sequence is feasible. Greater cell conversion efficiency is presented

Investigation of proposed process sequence for the array automated assembly task: Phase II. Quarterly technical progress report for quarter ending December 29, 1979

A sulfur hexaflouride plasma etch was investigated as a possible surface treatment to improve the performance of the cell, the Radiation Technology Infrared Furnace was qualified for use in the process sequence, and work was initiated on junction clean up by laser scribing through the junction. An evaluation of the minority carrier diffusion length of silicon crystals received from various vendors was also included in this quarters activities. Results are presented and discussed

Investigation of proposed process sequence for the array automated assembly task: Phase II. Quarterly technical progress report for quarter ending September 29, 1979

Plasma etching was investigated as a possible surface preparation process, the Radiation Technology Infrared Furnace was tested as a possible replacement for the currently used tube furnace, and the fixture for laminating 2' by 4' panels was completed and panels are currently being tested. Progress is reported in detail. (WHK