Development of a Reference Wafer for On-Wafer Testing of Extreme Impedance Devices

This paper describes the design, fabrication, and testing of an on-wafer substrate that has been developed specifically for measuring extreme impedance devices using an on-wafer probe station. Such devices include carbon nano-tubes (CNTs) and structures based on graphene which possess impedances in the κ Ω range and are generally realised on the nano-scale rather than the micro-scale that is used for conventional on-wafer measurement. These impedances are far removed from the conventional 50- reference impedance of the test equipment. The on-wafer substrate includes methods for transforming from the micro-scale towards the nano-scale and reference standards to enable calibrations for extreme impedance devices. The paper includes typical results obtained from the designed wafer

National child measurement programme: detailed analysis of the 2007/08 national dataset

This report presents detailed secondary analyses to further our understanding of the epidemiology of child height, weight and Body Mass Index (BMI) across England. It attempts to explain some of the findings presented in the NHS Information Centre for Health and Social Care 2007/08 NCMP report. The report provides analysis of PCT participation levels and investigates data quality issues in the collection of the 2007/08 NCMP dataset. Data on prevalence of underweight, healthy weight, overweight and obesity are analysed, comparing the 2007/08 data to the 2006/07, and the 1990 baseline. Analyses by deprivation and ethnic group are also included. The report further examines how the distribution of BMI differs by age and sex of the child sample population, and investigates changes since the 1990 baseline. It looks at the association between obesity prevalence and characteristics of the individual children and the PCTs in which they were measured using regression analysis

Microwave characterization of low-loss FDM 3-D printed ABS with dielectric-filled metal-pipe rectangular waveguide spectroscopy

Over time the accuracy and speed by which a material can be characterized should improve. Today, the Nicolson-Ross-Weir (NRW) methodology represents a well-established method for extracting complex dielectric properties at microwave frequencies, with the use of a modern vector network analyzer. However, as will be seen, this approach suffers from three fundamental limitations to accuracy. Challenging NRW methods requires a methodical and robust investigation. To this end, using a dielectric-filled metal-pipe rectangular waveguide, five independent approaches are employed to accurately characterize the sample at the Fabry-Pérot resonance frequency (non-frequency dispersive modeling). In addition, manual Graphical and automated Renormalization spectroscopic approaches are introduced for the first time in waveguide. The results from these various modeling strategies are then compared and contrasted to NRW approaches. As a timely exemplar, 3-D printed acrylonitrile-butadiene-styrene (ABS) samples are characterized and the results compared with existing data available in the open literature. It is found that the various Fabry-Pérot resonance model results all agree with one another and validate the two new spectroscopic approaches; in so doing, exposing three limitations of the NRW methods. It is also shown that extracted dielectric properties for ABS differ from previously reported results and reasons for this are discussed. From measurement noise resilience analysis, a methodology is presented for determining the upper-bound signal-to-noise ratio for the vector network analyzer (not normally associated with such instrumentation). Finally, fused deposition modeling (FDM) 3-D printing results in a non-homogeneous sample that excites open-box mode resonances. This phenomenon is investigated for the first time, analytically and with various modeling strategies

Evaluation of a VNA-based Material Characterization Kit at Frequencies from 0.75 THz to 1.1 THz

This paper describes an initial assessment of a commercially available THz material characterization kit (MCK). The assessment is based on the measurement of several material samples. The MCK comprises two conical waveguide horn transitions and two sections of low-loss corrugated waveguide. A gap between the two corrugated waveguides allows the material samples to be inserted into the system during measurement. The MCK is attached to a THz Vector Network Analyzer (VNA), which measures S-parameters, in the frequency domain, of a material under test (MUT). A computer-based algorithm employing an iterative calculation derives values for material parameters (e.g. permittivity) from the measured S-parameters of the MUT. A MCK has been evaluated over the frequency range 0.75 THz to 1.1 THz, to assess the plausibility of results that can be obtained using such a technique. Two VNAs utilizing frequency extender heads were used for the investigation, with measurements being made with reference to a range of different calibration techniques and different calibration standards. Whilst some of the results obtained look reasonable, a significant proportion of the results were either difficult to interpret or showed inexplicable (i.e. non-physical) behavior. This indicates that much work is still needed before this technique can be used routinely for the measurement of material parameters at these very high frequencies

3-D printing quantization predistortion applied to sub-THz chained-function filters

This paper investigates physical dimension limits associated with the low-cost, polymer-based masked stereolithography apparatus (MSLA) 3-D printer, with 50 μm pixels defining the minimum print feature size. Based on the discretization properties of our MSLA 3-D printer, multi-step quantization predistortion is introduced to correct for registration errors between the CAD drawing and slicing software. This methodology is applied to G-band 5th order metal-pipe rectangular waveguide filters, where the pixel pitch has an equivalent electrical length of 8.5° at center frequency. When compared to the reference Chebyshev filter, our chained-function filter exhibits superior S-parameter measurements, with a low insertion loss of only 0.6 dB at its center frequency of 182 GHz, having a 0.9% frequency shift, and an acceptable worst-case passband return loss of 13 dB. Moreover, with measured dimensions after the 3-D printed parts have been commercially electroplated with a 50 μm thick layer of copper, the re-simulations are in good agreement with the S-parameter measurements. For the first time, systematic (quantization) errors associated with a pixel-based 3-D printer have been characterized and our robust predistortion methodology has been successfully demonstrated with an upper-millimeter-wave circuit. Indeed, we report the first polymer-based 3-D printed filters that operate above W-band. As pixel sizes continue to shrink, more resilient (sub-)THz filters with ever-higher frequencies of operation and more demanding specifications can be 3-D printed. Moreover, our work opens-up new opportunities for any pixel-based technology, which exhibits registration errors, with its application critically dependent on its minimum feature size

Polymer-based 3-D printed 140 to 220 GHz metal waveguide thru lines, twist and filters

This paper demonstrates the current state-of-the-art in low-cost, low loss ruggedized polymer-based 3-D printed G-band (140 to 220 GHz) metal-pipe rectangular waveguide (MPRWG) components. From a unique and exhaustive up-to-date literature review, the main limitations for G-band split-block MPRWGs are identified as electromagnetic (EM) radiation leakage, assembly part alignment and manufacturing accuracy. To mitigate against leakage and misalignment, we investigate a ‘trough-and-lid’ split-block solution. This approach is successfully employed in proof-of-concept thru lines, and in the first polymer-based 3-D printed 90° twist and symmetrical diaphragm inductive iris-coupled bandpass filters (BPFs) operating above 110 GHz. An inexpensive desktop masked stereolithography apparatus 3-D printer and a commercial copper electroplating service are used. Surface roughness losses are calculated and applied to EM (re-)simulations, using two modifications of the Hemispherical model. The 7.4 mm thru line exhibits a measured average dissipative attenuation of only 12.7 dB/m, with rectangular-to-trapezoidal cross-sectional distortion being the main contributor to loss. The 90° twist exhibits commensurate measured performance to its commercial counterpart, despite the much lower manufacturing costs. A detailed time-domain reflectometry analysis of flange quality for the thru lines and 90° twists has also been included. Finally, a new systematic iris corner rounding compensation technique, to correct passband frequency down-shifting is applied to two BPFs. Here, the 175 GHz exemplar exhibits only 0.5% center frequency up-shifting. The trough-and-lid assembly is now a viable solution for new upper-mm-wave MPRWG components. With this technology becoming less expensive and more accurate, higher frequencies and/or more demanding specifications can be implemented

3-D printed rectangular waveguide 123-129 GHz packaging for commercial CMOS RFICs

This work demonstrates the hybrid integration of a complementary metal–oxide–semiconductor (CMOS) radio frequency integrated circuit (RFIC) into a host 3-D printed metal-pipe rectangular waveguide (MPRWG). On-chip Vivaldi antennas are used for TE 10 -to-thin-film microstrip (TFMS) mode conversion. Our packaging solution has a combined measured insertion loss of only 1 dB/transition at 126 GHz. This unique packaging and interconnect solution opens up new opportunities for implementing low-cost subterahertz (THz) multichip modules

3-D Printed Plug and Play Prototyping for Low-cost Sub-THz Subsystems

Polymer-based additive manufacturing using 3-D printing for upper-millimeter-wave ( ca. 100 to 300 GHz) frequency applications is now emerging. Building on our previous work, with metal-pipe rectangular waveguides and free-space quasi-optical components, this paper brings the two media together at G-band (140 to 220 GHz), by demonstrating a compact multi-channel front-end subsystem. Here, the proof-of-concept demonstrator integrates eight different types of 3-D printed components (30 individual components in total). In addition, the housing for two test platforms and the subsystem are all 3-D printed as single pieces, to support plug and play development; offering effortless component assembly and alignment. We introduce bespoke free-space TRM calibration and measurement schemes with our quasi-optical test platforms. Equal power splitting plays a critical role in our multi-channel application. Here, we introduce a broadband 3-D printed quasi-optical beamsplitter for upper-millimeter-wave applications. Our quantitative and/or qualitative performance evaluations for individual components and the complete integrated subsystem, demonstrate the potential for using consumer-level desktop 3-D printing technologies at such high frequencies. This work opens-up new opportunities for low-cost, rapid prototyping and small-batch production of complete millimeter-wave front-end subsystems