Functional flexibility: The potential of morphing composites

From plants tracking the sun to the aerodynamics of bird wings, shape change is key to the performance of natural structures. After years of reliance on mechanical joints, human engineering now focuses on improving aerodynamic efficiency through smooth, full form changes in material geometry, achieved using technologies such as morphing composites. Promising improved power generation and efficiency in wind turbines and safer more sustainable aircraft and cars, these materials can achieve both large geometric changes with low energy requirements by cycling between several stable physical states and more gradual changes in geometry by exploiting coefficient of thermal expansion mismatch and structural anisotropy, shape memory polymers and 4D printing. The merits and limitations of these various shape change systems are the subject of extensive and ongoing academic research and both commercial and defence industry trials to improve the viability of these technologies for widespread adoption. Shape change capabilities are often associated with problems in material cost, mass, mechanical properties, manufacturability, and energy requirements. Nonetheless, the considerable and rapid advances in this technology, already resulting in successful trials in advanced civilian and military aircraft and high-performance cars, indicate that future research and development of this materials platform could revolutionise many of our most critical power generation, defence and transport systems

Propylthiouracil Is Teratogenic in Murine Embryos

Background: Hyperthyroidism during pregnancy is treated with the antithyroid drugs (ATD) propylthiouracil (PTU) and methimazole (MMI). PTU currently is recommended as the drug of choice during early pregnancy. Yet, despite widespread ATD use in pregnancy, formal studies of ATD teratogenic effects have not been performed. Methods: We examined the teratogenic effects of PTU and MMI during embryogenesis in mice. To span different periods of embryogenesis, dams were treated with compounds or vehicle daily from embryonic day (E) 7.5 to 9.5 or from E3.5 to E7.5. Embryos were examined for gross malformations at E10.5 or E18.5 followed by histological and micro-CT analysis. Influences of PTU on gene expression levels were examined by RNA microarray analysis. Results: When dams were treated from E7.5 to E9.5 with PTU, neural tube and cardiac abnormalities were observed at E10.5. Cranial neural tube defects were significantly more common among the PTU-exposed embryos than those exposed to MMI or vehicle. Blood in the pericardial sac, which is a feature indicative of abnormal cardiac function and/or abnormal vasculature, was observed more frequently in PTU-treated than MMI-treated or vehicle-treated embryos. Following PTU treatment, a total of 134 differentially expressed genes were identified. Disrupted genetic pathways were those associated with cytoskeleton remodeling and keratin filaments. At E 18.5, no gross malformations were evident in either ATD group, but the number of viable PTU embryos per dam at E18.5 was significantly lower from those at E10.5, indicating loss o

A solid-state bonding technique of large copper wires for high power devices operating at high temperature

© 2015 Springer Science+Business Media New York Solid-state processes of bonding 1 mm copper (Cu) wires on Cu substrates and silicon (Si) chips, respectively, were developed. To overcome Cu oxidation issue, the bonding surface on the wire was plated a silver (Ag) layer. An annealing step followed to make the Ag layer much easier to deform and conform to the Cu or Si bonding surfaces. The bonding process was performed at 300 °C with 6.89 MPa. Wire-bond cross sections were studied using optical and electron microscopy, respectively. The images obtained exhibit nearly perfect Ag–Cu bonding interface. For wire-bonds made on Cu substrate, in-plane (shear) pull test measured a breaking of force 20.7–23.7 kg, comparable to the 22.5 kg breaking force of the Cu wire itself. Breaking forces on vertical (peel) pull test are about one-half of in-plane pull test results. For wire-bonds made on Si chip, breaking forces are about 80 % of those made on Cu substrate. Fracture modes were evaluated in details. 90 % of the wire-bonds broke with three modes mixed together: near Cu–Ag plating interface, inside Ag layer, and Ag–Cu bonding interface. Thus, the bonding interface is as strong as other regions of the wire-bond. This solid-state wire bonding process is expected to have valuable applications in high power and high temperature devices and modules where the wire-bonds have to stand alone without protection due to lack of high temperature molding compound and reinforcing materials