Two-photon direct laser writing beyond the diffraction limit using the nanopositioning and nanomeasuring machine

Since the first realization of two-photon direct laser writing (DLW) in Maruo et al. (Opt Lett 22:132-134, 1997), the manufacturing using direct laser writing techniques spread out in many laboratories all over the world. Photosensitive materials with different material properties open a new field for micro- and nanofabrication. The achievable structuring resolution using this technique is reported to be sub-100 nm (Paz et al. in J. Laser Appl. 24:042004, 2012), while a smallest linewidth of 25 nm could be shown in Tan et al. (Appl Phys Lett 90:071106, 2007). In our approach, the combination of DLW with the nanopositioning and nanomeasuring machine NMM-1 offers an improvement of the technique from the engineering side regarding the ultra-precise positioning (Weidenfeller et al. in Adv Fabr Technol Micro/Nano Opt Photon XI 10544:105440E, 2018). One big benefit besides the high positioning resolution of 0.1 nm is offered by the positioning range of 25 mm × 25 mm × 5 mm (Jäger et al. in Technisches Messen 67:319-323, 2000; Manske et al. in Meas Sci Technol 18:520-527, 2007). Thus, a trans-scale fabrication without any stitching or combination of different positioning systems is necessary. The immense synergy between the highly precise positioning and the DLW is demonstrated by the realization of resist lines and trenches whose center-to-center distance undergoes the modified diffraction limit for two-photon processes. The precise positioning accuracy enables a defined distance between illuminated lines. Hence, with a comparable huge width of the trenches of 1.655 [my]m due to a low effective numerical aperture of 0.16, a resist line of 30 nm between two written trenches could be achieved. Although the interrelationships for achieving such narrow trenches have not yet been clarified, much smaller resist lines and trench widths are possible with this approach in the near future

Thermal analysis of the ceramic material and evaluation of the bonding behavior of silicon-ceramic composite substrates

Abstract Thermal bonding of silicon and low-temperature cofired ceramics (LTCC) at sintering temperatures of 900 ° C represents currently the standard process in silicon-ceramic composite (SiCer) substrate fabrication. We analyse the thermal behavior of the LTCC using thermogravimetric analysis, differential scanning calorimetry and laser flash analysis. The thermal decomposition could be identified with a mass loss of 24% in the temperature range up to 1000 ° C what influences the thermal diffusivity with values from about 0.19 mm 2 s −1 before thermal treatment to below 0.10 mm 2 s −1 after thermal treatment. A specific heat capacity of 1 – 2 J (g · K) −1 is calculated. Further, an influence of low-temperature lamination of the LTCC seems to have an influence on the thermal behaviour. The sintering process was investigated with temperatures of 550 ° C, 730 ° C and 900 ° C, applied pressures of 12.2 kPa and 6.1 kPa and intermediate wetting layers of TiO 2 (normal deposition and oblique angle deposition). Optical observations, ultrasonic and scanning electron microscopy, and pull-tests are used to compare the properties of the sintered SiCer substrates. Whereas the sintering temperature has an obvious impact on the sintering behaviour of the LTCC, a direct conclusion of parameter variation on the bonding result was not observed

Tip- and laser-based 3D nanofabrication in extended macroscopic working areas

The field of optical lithography is subject to intense research and has gained enormous improvement. However, the effort necessary for creating structures at the size of 20 nm and below is considerable using conventional technologies. This effort and the resulting financial requirements can only be tackled by few global companies and thus a paradigm change for the semiconductor industry is conceivable: custom design and solutions for specific applications will dominate future development (Fritze in: Panning EM, Liddle JA (eds) Novel patterning technologies. International society for optics and photonics. SPIE, Bellingham, 2021. https://doi.org/10.1117/12.2593229). For this reason, new aspects arise for future lithography, which is why enormous effort has been directed to the development of alternative fabrication technologies. Yet, the technologies emerging from this process, which are promising for coping with the current resolution and accuracy challenges, are only demonstrated as a proof-of-concept on a lab scale of several square micrometers. Such scale is not adequate for the requirements of modern lithography; therefore, there is the need for new and alternative cross-scale solutions to further advance the possibilities of unconventional nanotechnologies. Similar challenges arise because of the technical progress in various other fields, realizing new and unique functionalities based on nanoscale effects, e.g., in nanophotonics, quantum computing, energy harvesting, and life sciences. Experimental platforms for basic research in the field of scale-spanning nanomeasuring and nanofabrication are necessary for these tasks, which are available at the Technische Universität Ilmenau in the form of nanopositioning and nanomeasuring (NPM) machines. With this equipment, the limits of technical structurability are explored for high-performance tip-based and laser-based processes for enabling real 3D nanofabrication with the highest precision in an adequate working range of several thousand cubic millimeters

Metrologische Nanopositionierung kombiniert mit Zwei-Photonen-Laserdirektschreiben

The extension of nanopositioning and nanomeasuring machines (NPM-machines) to fabrication machines by using a femtosecond laser for the implementation of direct laser writing by means of two-photon absorption (2PA) is a promising approach for cross-scale metrological fabrication in the field of lithographic techniques [24]. To this end, a concept for integrating two-photon technology into an NPM machine was developed and implemented, followed by a characterization of the system and targeted investigations to provide evidence for the synergy of the two techniques. On this basis, a new approach to high-throughput micro- and nano-fabrication was developed and investigated, demonstrating new possibilities in cross-scale, high-precision manufacturing [6]. This mixand-match approach is based on a combination of 2PA laser writing with field emission lithography to fabricate masters for subsequent nanoimprint lithography. Not only the advantages of the large positioning range of the NMM-1 could be highlighted, but also the advantages resulting from the highly accurate positioning. A systematic reduction of the distance between two adjacent lines resulted in a minimum photoresist width of less than 30 nm [16], which can be classified among the smallest distances between two laser-written lines described in the literature [4, 10, 20]. The center-to-center distance of the lines of about 1.695 μm at a numerical aperture of 0.16 and a wavelength of 801 nm is only about 56 % of the Rayleigh diffraction limit extended for the two-photon process. Thus, for the first time, a resist width far below the diffraction limit could be realized with conventional two-photon laser writing in positive photoresist.507514897-

Modifications to a high-precision direct laser writing setup to improve its laser microfabrication

Two-photon-absorption (2PA) techniques enables the possibility to create extremely fine structures in photosensitive materials. For direct laser writing as micro- or nanofabrication a laser system can be combined with highly precise positioning systems. These are mostly limited by a few hundreds micrometer positioning range with applications based on piezoelectric stages or even just relatively few tens micrometer positioning range with applications based on galvanometer scanners. Although these techniques are precise, but stitching methods are required for larger fabrication areas. Therefore, a setup consisting of a femtosecond laser for 2PA and a nanopositioning and nanomeasuring machine (NMM-1) was developed for high precision laser writing on lager surfaces. Further developments of the system should enable a significant improvement in high-precision and stitching free direct laser writing. In order to combine the the femtosecond laser and the NMM-1 into a functional unit, to write complex structures with highest accuracy and homogeneity, further improvements like a beam expansion for a better use of the numerical aperture of the objective and a new femtosecond laser with a integrated power measurement are realized. This showed improvements in line width for nano strucuring. Advantages and disadvantages as well as further developments of the NMM-1 system will be discussed related to current developments in the laser beam and nanopositioning system optimization.Article 119890U1198