1 research outputs found
Wetting Regimes for Residual-Layer-Free Transfer Molding at Micro- and Nanoscales
Transfer
molding offers a low-cost approach
to large-area fabrication of isolated structures in a variety of materials
when recessed features of the open-faced mold are filled without leaving
a residual layer on the plateaus of the mold. Considering both macroscale
dewetting and microscale capillary flow, a proposed map of wetting
regimes for blade meniscus coating provides a guide for achieving
discontinuous dewetting at maximum throughput. Dependence of meniscus
morphology on the azimuthal orientation of the stamp provides insight
into the dominant mechanisms for discontinuous dewetting of one-dimensional
(1-D) patterns. Critical meniscus velocity is measured and residual-layer-free
filling is demonstrated for 1-D patterned soft molds (stamps) with
periods ranging from 140 nm to 6 μm. Transfer of isolated lines,
and multilayer woodpile structures were achieved through plasma bonding.
These results are relevant to other roll-to-roll compatible processes
for scalable production of high-resolution structures across large
areas