12 research outputs found

    III-V on-silicon sources for optical interconnect applications

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    Optical interconnects require efficient and flexible optical sources. This paper presents results on two technology platforms being developed for realizing these. Integration using wafer bonding technologies is well established now and the focus is on new device types including tunable lasers, multi-wavelength lasers and switching. As an alternative, we also started work on monolithic integration using heteroepitaxy directly on silicon. We here report recent results on low threshold nanowire lasers

    Photonic subsystems for optical packet/burst switches based on heterogeneous SOI and III-V integration

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    In this paper we describe how high-quality silicon photonic ICs and III-V membrane switches integrated on this platform can be used to build photonic subsystems for optical packet switches
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