Large-area ultrathin Te films with substrate-tunable orientation

Anisotropy in a crystal structure can lead to large orientation-dependent variations of mechanical, optical, and electronic properties. Material orientation control can thus provide a handle to manipulate properties. Here, a novel sputtering approach for 2D materials enables growth of ultrathin (2.5-10 nm) tellurium films with rational control of the crystalline orientation templated by the substrate. The anisotropic Te helical chains align in the plane of the substrate on highly oriented pyrolytic graphite (HOPG) and orthogonally to MgO(100) substrates, as shown by polarized Raman spectroscopy and high-resolution electron microscopy. Furthermore, the films are shown to grow in a textured fashion on HOPG, in contrast with previous reports. These ultrathin Te films cover exceptionally large areas (>1 cm2) and are grown at low temperature (25 oC) affording the ability to accommodate a variety of substrates including flexible electronics. They are robust toward oxidation over a period of days and exhibit the non-centrosymmetric P3121 Te structure. Raman signals are acutely dependent on film thickness, suggesting that optical anisotropy persists and is even enhanced at the ultrathin limit. Hall effect measurements indicate orientation-dependent carrier mobility up to 19 cm2V-1s-1. These large-area, ultrathin Te films grown by a truly scalable, physical vapor deposition technique with rational control of orientation/thickness open avenues for controlled orientation-dependent properties in semiconducting thin films for applications in electronic and optoelectronic devices

HVPE growth and characterization of GaP on different substrates and patterned templates for frequency conversion devices

This article describes efforts to achieve fast deposition of thick Quasi-Phase-Matched (QPM) GaP structures with high surface and structural quality on oriented patterned (OP) templates in a Hydride Vapor Phase Epitaxial (HVPE) process. These QPM structures will be incorporated in devices for conversion of frequencies from the near infrared to the mid infrared and THz regions, where powerful and tunable sources are in great demand for both military and civilian applications. In contrast with GaAs—the most studied OP QPM material—the two-photon absorption of GaP is predicted to be extremely low, which allows pumping with a number of convenient sources between 1 – 1.7 µm. Unpatterned GaP layers up to 370 µm thick were grown with growth rates up to 93 µm/hr with high reproducibility on bare substrates. The layers demonstrated smooth surface morphology with RMS < 1 nm and high structural quality with FWHM equal to 39 arcsec for layers grown on GaP and 112 arcsec for those grown on GaAs. Growth on OP-GaP templates resulted in 142 µm thick QPM structures deposited at a growth rate of 71 µm/h with good vertical (normal to the layer surface) propagation of the initial pattern. When the growth was performed on OP-GaAs one of the domains showed a trend toward a faceting growth. Further investigations are in progress to equalize the vertical and lateral growth of the two domains, and determine the best orientation of the substrate and pattern in order to achieve structures thick enough for high power nonlinear applications

Low Temperature Growth of In2O3and InN Nanocrystals on Si(111) via Chemical Vapour Deposition Based on the Sublimation of NH4Cl in In

Indium oxide (In2O3) nanocrystals (NCs) have been obtained via atmospheric pressure, chemical vapour deposition (APCVD) on Si(111) via the direct oxidation of In with Ar:10% O2at 1000 °C but also at temperatures as low as 500 °C by the sublimation of ammonium chloride (NH4Cl) which is incorporated into the In under a gas flow of nitrogen (N2). Similarly InN NCs have also been obtained using sublimation of NH4Cl in a gas flow of NH3. During oxidation of In under a flow of O2the transfer of In into the gas stream is inhibited by the formation of In2O3around the In powder which breaks up only at high temperatures, i.e.T > 900 °C, thereby releasing In into the gas stream which can then react with O2leading to a high yield formation of isolated 500 nm In2O3octahedrons but also chains of these nanostructures. No such NCs were obtained by direct oxidation forTG < 900 °C. The incorporation of NH4Cl in the In leads to the sublimation of NH4Cl into NH3and HCl at around 338 °C which in turn produces an efficient dispersion and transfer of the whole In into the gas stream of N2where it reacts with HCl forming primarily InCl. The latter adsorbs onto the Si(111) where it reacts with H2O and O2leading to the formation of In2O3nanopyramids on Si(111). The rest of the InCl is carried downstream, where it solidifies at lower temperatures, and rapidly breaks down into metallic In upon exposure to H2O in the air. Upon carrying out the reaction of In with NH4Cl at 600 °C under NH3as opposed to N2, we obtain InN nanoparticles on Si(111) with an average diameter of 300 nm

Heteroepitaxial Growth Of Opgap On Opgaas For Frequency Conversion In The Ir And Thz

Abstract: For the first time thick orientation-patterned GaP (OPGaP) was repeatedly grown heteroepitaxially on OPGaAs templates as a quasi-phase matched medium for frequency conversion in the mid and longwave IR, and THz regions. The OP templates were fabricated by wafer-bonding and in a MBE-assisted polarity inversion process. Standard low-pressure hydride vapor phase epitaxy (LP-HVPE) was used for one-step growth of up to 400 μm thick device quality OPGaP with excellent domain fidelity. The presented results can be viewed as the missing link between a welldeveloped technique for preparation of OP templates, using one robust nonlinear optical material (GaAs), and the subsequent thick epitaxial growth on them of another material (GaP). The reason for these efforts is that the second material has some indisputable advantages in point of view of thermal and optical properties but the preparation of native templates encounters challenges, which makes it difficult to obtain high quality homoepitaxial growth at an affordable price. Successful heteroepitaxial growth at such a relatively high lattice mismatch (- 3.6%) in a close to equilibrium growth process such as HVPE is noteworthy, especially when previously reported attempts, for example, growth of OPZnSe on OPGaAs templates at about 10 times smaller lattice mismatch (+ 0.3%) have produced only limited results. Combining the advantages of the two most promising nonlinear materials, GaAs and GaP, is a solution that will accelerate the development of high power, tunable laser sources for the IR and THz region, which are in great demand on the market

Gamma-ray radiation effects in graphene-based transistors with h-BN nanometer film substrates

Radiation effects on graphene field effect transistors (GFETs) with hexagonal boron nitride (h-BN) thin film substrates are investigated using 60Co gamma-ray radiation. This study examines the radiation response using many samples with varying h-BN film thicknesses (1.6 and 20 nm thickness) and graphene channel lengths (5 and 10 μm). These samples were exposed to a total ionizing dose of approximately 1 Mrad(Si). I-V measurements were taken at fixed time intervals between irradiations and postirradiation. Dirac point voltage and current are extracted from the I-V measurements, as well as mobility, Dirac voltage hysteresis, and the total number of GFETs that remain properly operational. The results show a decrease in Dirac voltage during irradiation, with a rise of this voltage and permanent drop in Dirac current postirradiation. 1.6 nm h-BN substrate GFETs show an increase in mobility during irradiation, which drops back to preirradiation conditions in postirradiation measurements. Hysteretic changes to the Dirac voltage are the strongest during irradiation for the 20 nm thick h-BN substrate GFETs and after irradiation for the 1.6 nm thick h-BN GFETs. Failure rates were similar for most GFET types during irradiation; however, after irradiation, GFETs with 20 nm h-BN substrates experienced substantially more failures compared to 1.6 nm h-BN substrate GFETs