H loss mechanism during anneal of silicon nitride: chemical dissociation

Journal ArticleRemote plasma enhanced chemical vapor deposited silicon nitride (SixNyHz), produced at high ammonia to silane flow rates (ammonia rich) shows a reduction of hydrogen during rapid thermal anneal at temperatures that exceed the deposition temperature. This H release could be either due to a ‘‘slow'' atomic diffusion of the covalent bonded atoms between bonding sites, or to a ‘‘fast'' molecular diffusion of hydrogen containing molecules (e.g., H2, NH3, SiH4), which dissociate from the network before they diffuse. In order to determine the dominant mechanism, layers of deuterated and hydrogenated silicon nitride on top of a crystalline Si substrate were annealed and the development of the NH- and ND-area densities were measured with Fourier transform infrared spectroscopy. Comparison of theoretical models with the measurements showed that chemical dissociation and subsequent rapid diffusion are the dominant processes. These results were confirmed by secondary ion mass spectroscopy. The experiments indicate that the H reduction in silicon nitride antireflection coatings of solar cells is mostly due to H migration out of the system and not into the Si area and make the hypothesis that postdeposition annealing of solar cell antireflection coatings can cause H-related bulk passivation of the underlying c-Si therefore questionable

Diffusion of hydrogen and deuterium in stack systems of SixNyHz/SixNyDz and crystalline Si

Journal ArticleH/D-, N-H/D- and Si-H/D-bond density changes were investigated in stacks consisting of a Cz-Si substrate, a thin layer of SiC>2, amorphous deuterated silicon nitride as well as amorphous hydrogenated silicon nitride in order to see if the post deposition anneal of a-SixNyHz layers on crystalline silicon wafers can actually lead to a migration of H atoms into the Si-bulk, which is an important question in regard to emitter passivation of Si-solar cells. The stacks were grown with remote plasma enhanced chemical vapor deposition (RPECVD). A low temperature (=200°C) process of down stream injected ammonia (NH3) and silane (SiH4) activated by an upstream injected He-plasma, produced through RF-radiation (13.65MHz) was used. Thermal treatment was executed by ex situ rapid thermal anneal in Ar ambient. For the measurements of H and D bond densities, FTIR was employed while SIMS determined atomic densities of H, D and O in the c-Si/nitride interface region. The experiments showed that H transport in silicon nitride is determined by several mechanisms including diffusion and dissociation processes and that silicon nitride deposited with high ammonia to silane ratios can produce molecular species like ammonia and H2. The study of the reaction dynamics showed that the production of molecular hydrogen is the most dominant process as long as Si-H-bonds are present in the system. After their exhaustion, an ammonia producing reaction prevails that leads with increasing temperatures to lower densities in the nitride films

Intermixing between HfO2 and GeO2 films deposited on Ge(001) and Si(001) : role of the substrate

Thermally driven atomic transport in HfO2 /GeO2/substrate structures on Ge 001 and Si 001 was investigated in N2 ambient as function of annealing temperature and time. As-deposited stacks showed no detectable intermixing and no instabilities were observed on Si. On Ge, loss of O and Ge was detected in all annealed samples, presumably due to evolution of GeO from the GeO2 /Ge interface. In addition, hafnium germanate is formed at 600 °C. Our data indicate that at 500 °C and above HfO2 /GeO2 stacks are stable only if isolated from the Ge substrate

Thermal stability of plasma-nitrided aluminum oxide films on Si

The effect of post-deposition rapid thermal annealing in vacuum and in dry O2 on the stability of remote plasma-assisted nitrided aluminum oxide films on silicon is investigated. The areal densities of Al, O, N, and Si were determined by nuclear reaction analysis and their concentration versus depth distributions by narrow nuclear reaction resonance profiling, with subnanometric depth resolution. Annealing in both vacuum and O2 atmospheres produced partial loss of N from the near-surface regions of the films and its transport into near-interface regions of the Si substrate. Oxygen from the gas phase was incorporated in the AlON films in exchange for O and N previously existing therein, as well as in the near-interface regions of the Si substrate, leading to oxynitridation of the substrate. Al and Si remained essentially immobile under rapid thermal processing, confirming that the presence of nitrogen improves the thermal stability characteristics of the AlON/ Si structures in comparison with non-nitrided Al2O3 /Si

Origin of charge density at LaAlO3-on-SrTiO3 hetero-interfaces; possibility of intrinsic doping

As discovered by Ohtomo et al., a large sheet charge density with high mobility exists at the interface between SrTiO3 and LaAlO3. Based on transport, spectroscopic and oxygen-annealing experiments, we conclude that extrinsic defects in the form of oxygen vacancies introduced by the pulsed laser deposition process used by all researchers to date to make these samples is the source of the large carrier densities. Annealing experiments show a limiting carrier density. We also present a model that explains the high mobility based on carrier redistribution due to an increased dielectric constant.Comment: 14 pages, 3 figures, 1 table; accepted for publication in Phys. Rev. Lett