Method for detecting leaks in hermetically sealed containers Patent

Method for locating leaks in hermetically sealed container

Apparatus and method for separating a semiconductor wafer Patent

Separation of semiconductor wafer into chips bounded by scribe line

Improved method of dicing integrated circuit wafers into chips

Method employing a pressure chamber is used for dicing semiconductor single-crystal wafers, containing integrated circuits, into small chips along pre-scribed lines. Uniform bending of the scribed wafer over the convex surface of a perforated hemisphere, breaks it cleanly into individual chips without damaging the circuits