Cooling of Active Components in Structurally Integrated Phased Arrays Antennas

This paper presents an innovative cooling solution for active phased array antennas, using a 3D printed liquid cooling device integrated in the structure’s PCB

Degenerativer Vorfuß

The hallux valgus deformity is the most common toe deformity of the forefoot and is often associated with asplayfoot. Malpositioning of the small toes may be isolated but are more common in other foot deformities. The understanding of the complex pathoanatomy of the foot is necessary for orthopedic treatment. Conservative treatment is reserved for the early stages. The indications for surgery should be based on clinical and radiographic findings. Countless surgical procedures are available and minimally invasive surgical techniques are also increasingly being used

Klinische Untersuchung des Fußes

Asystematic clinical examination of the foot, including astructured medical history, is essential for the diagnostics of foot disorders. The foot and ankle, with a total of 28bones and numerous joints, require avariety of musculotendinous and neuromuscular structures for stabilization and faultless gait. Almost all anatomical structures of the foot are easily accessible for a manual clinical examination due to the sparse soft tissue covering. This requires differentiated and well-founded anatomical knowledge as well as examination experience to be able to distinguish anormal finding from apathological abnormality. The examination of the contralateral foot is always necessary. A targeted supplementary imaging examination completes the diagnosis

Rheumaoperationen im Wandel – „Fuß“

Surgical management of rheumatic feet has dramatically changed over the last decades influenced by the development of new pharmacological drugs and tissue-preserving surgical procedures. It has switched from joint resection to joint-sparing procedures as the method of choice. Nevertheless, the surgical interventions commonly used for non-rheumatic patients cannot be applied to rheumatic patients without reflection: in addition to the basic treatment, comorbidities, degree of mobilization of the patient, orthopedic shoe engineering and orthotic treatment play a major role. Due to the decreasing incidence of the classical rheumatic foot, it has become even more important for physicians, physiotherapists and ergotherapists to recognize the development of such a disease as early as possible and immediately start the appropriate treatment

Integration of a Ka-Band Front-End Components Using a Copper Core Printed Circuit Board

Increasing demand for high bandwidth wireless satellite connections and telecommunications has resulted in interest in steerable antenna arrays in the GHz frequency range. These applications require cost-effective integration technologies for high frequency and high power integrated circuits (ICs) using GaAs, for example. In this paper, an integration platform is proposed, that enables GaAs ICs to be directly placed on a copper core inside cavities of a high frequency laminate for optimal cooling purposes. The platform is used to integrate a frequency doubler/amplifier and an I/Q Mixer to produce a -9 dBm RF output with approximately 20 dB second sideband isolation

Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz

High-gain steerable antenna arrays in the K-, Ka-, and V-frequency bands have the potential to facilitate high-bandwidth satellite communication for a variety of applications. Copper-core printed circuit boards (PCBs) can offer a cost-effective integration platform for such systems by simultaneously addressing both the high frequency and thermal challenges. Integrating GaAs dies into test vehicles has shown that copper-core PCBs can be automatically assembled and provide high-frequency systems that show adequate reliability during thermal cycling. A single 60-GHz transmitter front end, designed to drive a single element of a phased array, with a 2-GHz bandwidth signal, composed of four GaAs dies, including a phase shifter, integrated onto a copper-core PCB produces an output power of -4 dBm and maintains an on-chip temperature under 51 °C