Schematic of the chemical bonding between the TiO⁻ and the silane coupling agent.

<p>Schematic of the chemical bonding between the TiO⁻ and the silane coupling agent.</p

FESEM images of two cured samples with different types of adhesion promoters (5.0%) after sintering on a hotplate at 180°C for 1 hour.

<p>FESEM images of two cured samples with different types of adhesion promoters (5.0%) after sintering on a hotplate at 180°C for 1 hour.</p

FESEM images of two cured samples with different types of adhesion promoter (5.0%) after further annealing in an oven chamber at 300°C for 96 hours.

<p>FESEM images of two cured samples with different types of adhesion promoter (5.0%) after further annealing in an oven chamber at 300°C for 96 hours.</p

Mass loss versus curing temperature.

<p>After the critical curing temperature was determined, all printed samples were cured using a hotplate at 180°C for 1 hour.</p

Chemical structure of the silane coupling agent.

<p>The R-O structure represents the methoxy or ethoxy functional group. The X- structure represents organic coupling groups such as the epoxy, amino or vinyl group.</p

Sample groups containing different weight percentages and types of adhesion promoter.

<p>Sample groups containing different weight percentages and types of adhesion promoter.</p

Inter-network of silver particles created from the PEI ink after the heat sintering process.

<p>Inter-network of silver particles created from the PEI ink after the heat sintering process.</p

The DOE of the silver powder content and the solvent content.

<p>The DOE of the silver powder content and the solvent content.</p

Figure 1

<p>(a) A printed line pattern on an epoxy molding compound that was printed using silver ink. (b) An FIB cross-sectional view of the thickness of the printed silver layer.</p

Cross-sectional view of the silver film on the epoxy molding compound when no adhesion promoter was used.

<p>Cross-sectional view of the silver film on the epoxy molding compound when no adhesion promoter was used.</p