Finite element analysis of conceptual lumbar spine for different lifting position

The Lower-back pain (LBP) which is caused by lifting loads manually is one of the common issues faced by industrial workers. The objective of this paper is to determined the maximum stress and displacement on human lumbar by using computer aided engineering (CAE) software called Msc. Patran/Nastran. The 3D modeling of the lumbar spine from transferring data points of 3D scanner is reconstructed. The stress used for lifting loads from 20 to 60 kg is ranging between 2.52 to 74.1 MPa. The results showed that the end plate at 5th lumbar is experiencing the maximum stress development. This analysis is relevant to the industries especially manufacturing sector in order to provide a direction for ergonomists in the modification of jobs for workers who perform manual lifting. In order to gain a higher precision, it is suggested in the future that the lumbar spine is to be built based directly on a loaded CT scan and biodynamic loading situation with vibration and impact

Crushing behaviour of plain weave composite hexagonal cellular structure

The tradition of fibre composite materials in energy absorbing tube applications has gained interest in structural collisions in the composite materials industry. Thus, the subject of this work is the experimental investigation to understand the effects of the failure initiator at the specimen’s edge, causing the increase in the specific absorbed energy (SEA), as well as the influence of the cellular structure composed of cells with small hexagonal angle exhibited high energy absorption capability. An extensive experimental investigation of an in plane crashing behavior of the composite hexagonal cellular structure between platen has been carried out. The cellular structure composed of hexagonal cells with angles varying between 45 and 60°. The materials used to accomplish the study are the plain weave E-glass fabric as a reinforcement and the epoxy resin system as a matrix. Furthermore, the specific energy absorption increases as the hexagonal angle increases

Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process

Solder joint reliability has become an increasingly important factor in electronic industries to obtain sustainable and reliable electronic packages. The simulation study of 3D finite elements on BGA test assembly models with geometries of SMD-NSMD and NSMD-NSMD is conducted through ABAQUS software and is applied with Anand model equation. The applied loading onto the test assembly is set with reflow cooling temperature of 220 °C to 25 °C. The purpose of this research is to obtain the package warpage, stress, and inelastic equivalent strain throughout the package and solder joints and to develop a predictive finite element model for mechanics and deformation of solder joint in BGA package under reflow cooling. The results obtained showed that solder joints with NSMD-NSMD pad geometry has a greater inelastic equivalent strain and has a greater potential in failing than SMD-NSMD pad geometry. Therefore, it can be concluded that SMD-NSMD pad geometry is more preferable for obtaining a more reliable solder joint