Интенсивная пластическая деформация при температуре жидкого азота

Obtaining metallic materials with a grain size of tenths and hundredths of a micrometer (submicro and nanocrystals) with desired physicochemical properties is an important problem of modern materials science [1]. To date, several attempts have been made to refine the grain size by deformation at liquid nitrogen temperature [2–4], and most of this work was carried out on highly plastic copper. It seems relevant to a detailed study of the microstructure after cryogenic deformation, as well as the mechanisms of its formation. This work was aimed at a thorough certification of the microstructure of copper subjected to low-temperature deformation. For the certification of the microstructure, a relatively new method of automatic analysis of backscattered electron diffraction patterns (EBSD) was used

Механическое поведение меди, подвергнутой ударно-волновому нагружению

High-speed deformation allows you to create increased stresses in the material and thereby activate new deformation and fracture mechanisms. The grain size of the material is also capable of changing the deformation mechanisms and its mechanical behavior. In this connection, the purpose of this work was to study the effect of grain size on structural changes and strength properties of copper subjected to high-speed deformation by the action of shock waves of various amplitudes

Низкотемпературная деформация меди

The development and production of metals and alloys with grain sizes of tenths and hundredths of a micrometer (submicro- and nanocrystals) with desired physicochemical properties is an important problem of modern materials science [1]. Recently, a number of attempts have been made to use cryogenic deformation to grind grain size [2–4], and most of this work was performed on highly plastic copper. It seems relevant to a detailed study of the microstructure after cryogenic deformation, as well as the mechanisms of its formation. This work was aimed at a thorough certification of the microstructure of copper subjected to varying degrees of low-temperature deformation. For the certification of the microstructure, a relatively new method of automatic analysis of backscattered electron diffraction patterns (EBSD) was used

Деформация меди в криогенных условиях

Grinding the size of grains in structural materials can significantly improve their strength characteristics under cold deformation conditions and plastic under hot conditions. As a result, there is a steady practical interest in developing technologies that will drastically reduce the size of the grains. Currently, materials scientists are faced with the task of forming submicrocrystalline and nanocrystalline (SMC and NC) structures, moreover, in volumes suitable for industrial use

Рекристаллизация криогенно деформированной меди

In recent years, deformation at very low (cryogenic) temperatures has been considered as a promising approach for radical grinding of the grain structure. In this connection, it is of interest to estimate the thermal stability of cryogenically deformed materials. In this work, the evolution of the structure during low-temperature (50-250 ° C) annealing of copper subjected to preliminary cryogenic rolling to 90% reduction was investigated. It was found that recrystallization in the material begins at room temperature and ends after annealing at 150 ° C. The recrystallization process is accompanied by intense formation of annealing twins