In recent years, deformation at very low (cryogenic) temperatures has been considered as a promising approach for radical grinding of the grain structure. In this connection, it is of interest to estimate the thermal stability of cryogenically deformed materials. In this work, the evolution of the structure during low-temperature (50-250 ° C) annealing of copper subjected to preliminary cryogenic rolling to 90% reduction was investigated. It was found that recrystallization in the material begins at room temperature and ends after annealing at 150 ° C. The recrystallization process is accompanied by intense formation of annealing twins
