Modulation Schemes for Cognitive Radio in White Spaces

In this paper we give an overview and a comparison of the possible waveforms for white space applications. Four physical layer schemes for cognitive radio are selected for study: Orthogonal Frequency Division Multiplexing (OFDM), DFT-Spread OFDM (DFTS-OFDM), Constant Envelope OFDM (CE-OFDM) and Filter Bank Multicarrier (FBMC). The comparison is mainly based on the side effects of various non-ideal analog components (power amplifier, local oscillator) and residual synchronization errors such as frequency offset. As we will show, each technique has different sensitivity to the various impairments. The comparisons will be performed via spectral density functions and bit error rates (BER)

Improved stability regions for ground states of the extended Hubbard model

The ground state phase diagram of the extended Hubbard model containing nearest and next-to-nearest neighbor interactions is investigated in the thermodynamic limit using an exact method. It is found that taking into account local correlations and adding next-to-nearest neighbor interactions both have significant effects on the position of the phase boundaries. Improved stability domains for the $\eta$-pairing state and for the fully saturated ferromagnetic state at half filling have been constructed. The results show that these states are the ground states for model Hamiltonians with realistic values of the interaction parameters.Comment: 21 pages (10 figures are included) Revtex, revised version. To be published in Phys. Rev. B. E-mail: [email protected]

A scalable multi-functional thermal test chip family: design and evaluation

Nowadays, thermal characterization of IC packages and packaging technologies is becoming a key task in thermal engineering. To support this by measurements, we developed a family of thermal test chips that allow a wide range of possible applications. Our chips are based on the same basic cell that is mainly covered by dissipating resistors and also contains a temperature sensor. These basic cells are organized into arrays of different size. The arrays are designed such that further "super arrays" can also be built for tiling up larger package cavities. The first members of the family, TMC9 and TMC81, have been manufactured. Our measurements show that the goals aimed at the design have been achieved