624 research outputs found

    {1124} Deformation Twinning in Commercial Purity Titanium at Room Temperature

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    This is the accepted manuscript. It is currently embargoed pending publication.Definitive evidence from both electron back-scattered diffraction and transmission electron microscopy is shown for the existence of 1124 twinning as a rare deformation twinning mode in coarse grained commercial purity titanium after room temperature ballistic impact testing at 103 s−1. Non-Schmid-based twin type selection is demonstrated for 1124 and the conjugate 1122 deformation twinning modes in this material within grains where the c-axis is closely aligned to the loading direction. Limited Schmid-based twin variant selection is shown for 1124 and 1122 deformation twinning modes in this material. The occurrence of high area fractions of 1124 twinning has relevance for high strain rate plasticity modelling of grains of textured titanium compressed parallel to their c-axes.This work was supported by the Rolls-Royce plc / EPSRC strategic partnership under EP/H022309/1

    The Plane Strain Young’s Modulus in Cubic Materials

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    The orientation dependence of the plane strain Young’s modulus, E~\tilde E, of cubic materials has been analysed as a function of the direction along which a uniaxial stress is applied to a single crystal and the perpendicular direction in the single crystal along which the strain is constrained to be zero. The locus of E~\tilde E in the plane perpendicular to the axis of uniaxial stress is shown to be a circle when this stress is applied along \langle111\rangle. For materials with anisotropy ratios A > 1, global minima in E~\tilde E occur when the stress is applied along \langle001\rangle and when the strain along one of the two perpendicular \langle100\rangle directions is set to zero. Identical global maxima in E~\tilde E are found when the stress is applied along two different families of \langleuuw\rangle directions and the direction of zero strain is along either a perpendicular \langle11ˉ\bar 10\rangle or \langleww2ˉ\bar 2uˉ\bar u\rangle direction. For materials with A < 1, the global maxima in E~\tilde E occur when the stress is applied along \langle001\rangle and when the strain along one of the two perpendicular \langle100\rangle directions is set to zero, and identical global minima are found when the stress is applied along two different families of \langleuuw\rangle directions and the direction of zero strain is along either a perpendicular \langle11ˉ\bar 10\rangle or \langleww2ˉ\bar 2uˉ\bar u\rangle direction

    Interfacial reactions between sapphire and Ag-Cu-Ti-based active braze alloys

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    The interfacial reactions between two commercially available Ag–Cu–Ti-based active braze alloys and sapphire have been studied. In separate experiments, Ag– 35.3Cu–1.8Ti wt.% and Ag–26.7Cu–4.5Ti wt.% alloys have been sandwiched between pieces of R-plane orientated sapphire and heated in argon to temperatures between 750 and 900 °C for 1 min. The phases at the Ag–Cu– Ti/sapphire interfaces have been studied using selected area electron diffraction, energy dispersive X-ray spectroscopy and electron energy loss spectroscopy. Gradual and subtle changes at the Ag–Cu–Ti/sapphire interfaces were observed as a function of temperature, along with the formation of a transient phase that permitted wetting of the sapphire. Unequivocal evidence is shown that when the active braze alloys melt, titanium first migrates to the sapphire and reacts to dissolve up to ~33 at.% oxygen, forming a nanometre-size polycrystalline layer with a chemical composition of Ti₂O₁₋ₓ (x<<1). Ti₃Cu₃O particles subsequently nucleate behind the Ti₂O₁₋ₓ layer and grow to become a continuous micrometre-size layer, replacing the Ti₂O₁₋ₓ layer. Finally at 845 °C, a nanometre-size γ-TiO layer forms on the sapphire to leave a typical interfacial structure of Ag–Cu/Ti₃Cu₃O/γ-TiO/sapphire consistent with that seen in samples of polycrystalline alumina joined to itself with these active braze alloys. These experimental observations have been used to establish a definitive bonding mechanism for the joining of sapphire with Ag–Cu alloys activated by small amounts of titaniumWe are grateful for the financial support for this study provided by AWE.This is the author accepted manuscript. The final version is available from Elsevier via http://dx.doi.org/10.1016/j.actamat.2015.11.01
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