2 research outputs found

    Heat-Assisted Inkjet Printing of Tungsten Oxide for High-Performance Ultraviolet Photodetectors

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    An ammonium metatungstate precursor (WO<sub>3</sub>Pr) ink was printed for tungsten oxide (WO<sub>3</sub>) UV detectors on SiO<sub>2</sub>/Si wafers with prefabricated Au electrodes. A systematic study was carried out on the printing parameters including substrate temperatures in the range of 22–80 °C, WO<sub>3</sub>Pr molar concentrations of 0.01, 0.02, and 0.03 M, and printing scan numbers up to 7 to understand their effects on the resulted WO<sub>3</sub> film morphology and optoelectronic properties. It has been found that the printing parameters can sensitively affect the WO<sub>3</sub> film morphology, which in turn impacts the WO<sub>3</sub> photodetector performance. In particular, the printed films experienced a systematic change from discontinuous droplets at below 40 °C to continuous films at 40–60 °C of the substrate temperature. At higher temperatures, the excessive heat from the substrate not only caused drastic evaporation of the printed ink, resulting in highly nonuniform films, but also detrimental heating of the ink in the printer nozzle in proximity of the substrate, preventing continuous printing operation. An optimal printing window of the substrate temperature of 45–55 °C at a molar concentration of 0.02 M of ammonium metatungstate and three printing scans was obtained for the best UV detector performance. A large on/off ratio of 3538 and a high responsivity up to 2.70 A/W at 5 V bias (0.54 A/W·V) represent a significant improvement over the best report of ∼0.28 μA/W·V on WO<sub><i>X</i></sub> photodetectors, which indicates that the printed WO<sub>3</sub> films are promising for various applications of optoelectronics and sensors

    Interface Nanojunction Engineering of Electron-Depleted Tungsten Oxide Nanoparticles for High-Performance Ultraviolet Photodetection

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    This work reports a general and facile route, i.e., thermal decomposition of a precursor followed by ultrafast thermal annealing (TDP-UTA), to the in situ fabrication of a nanojunction-interlinked tungsten oxide nanoparticle (WO<sub>3</sub>-NP) networks for extraordinary ultraviolet (UV) photodetection. TDP leads a spin-coated ammonium metatungstate thin layer to in situ self-assemble into a highly crystalline WO<sub>3</sub>-NP mesoporous film on SiO<sub>2</sub>/Si substrates with prepatterned electrodes. The as-synthesized WO<sub>3</sub>-NPs have dimensions comparable to the Debye length (≈43 nm), which is critical to the optimal electron-depletion effect for high gain in photodetection. UTA creates the NP–NP interface nanojunctions between neighboring WO<sub>3</sub>-NPs, which is the key to high-efficiency electron transport with minimized charge recombination in optoelectronic processes. The photodetectors based on such nanojunction-interlinked WO<sub>3</sub>-NP networks exhibit a photocurrent-to-dark-current ratio of 5600, the highest value for any WO<sub><i>x</i></sub>-based photodetectors ever reported. Moreover, the obtained photoresponsivity is up to 139 A/W (or 27.8 A/W·V) upon 360 nm illumination, which is over 1 order of magnitude higher than that of any previously reported WO<sub><i>x</i></sub>-nanostructure film photodetectors. These results demonstrate that the TDP-UTA route is a low-cost, robust, and scalable pathway to the in situ fabrication of interlinked semiconducting-nanostructure networks for high-performance optoelectronics and sensors
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