Study of the Evolution of the Plastic Zone and Residual Stress in a Notched T-6061 Aluminum Sample

Using experimental measurements and numerical computations, this paper focuses on studying the evolution of the plastic zone and how the residual stresses change in a notched T-6061 aluminum sample. Before the crack initiation, digital image measurements were taken to visualize the evolution of the plastic zone. After the sample was fractured, the material microstructure and the residual stresses around the cracked zone were characterized through optical microscopy and X-ray diffractometry. This article describes in detail how the plastic zone evolved around the notch before the crack initiation and shows the close agreement between experimental and numerical data during the load increment. The surface residual stress values around the tip of the notched sample were also measured and computed to give a better understanding of the affected region during the fracture process

Study of the Evolution of the Plastic Zone and Residual Stress in a Notched T-6061 Aluminum Sample

Using experimental measurements and numerical computations, this paper focuses on studying the evolution of the plastic zone and how the residual stresses change in a notched T-6061 aluminum sample. Before the crack initiation, digital image measurements were taken to visualize the evolution of the plastic zone. After the sample was fractured, the material microstructure and the residual stresses around the cracked zone were characterized through optical microscopy and X-ray diffractometry. This article describes in detail how the plastic zone evolved around the notch before the crack initiation and shows the close agreement between experimental and numerical data during the load increment. The surface residual stress values around the tip of the notched sample were also measured and computed to give a better understanding of the affected region during the fracture process.</jats:p

Tecnología e Innovación en la Ingeniería

Este libro es una recopilación de los trabajos presentados, en el I Congreso Internacional de Tecnología, Ingeniería e Innovación CITII-2017, en la Universidad de San Buenaventura, sede Bogotá, en la cual participaron numerosas universidades, centros de investigación y otras entidades, con diferentes trabajos que se centran en la investigación y avances de innovación en distintas áreas de la Ingeniería, como Mecatrónica, Electrónica, Mecánica, Aeronáutica, Química, Ciencias Computacionales, Sonido, Agroindustrial e Industrial. Editorial Bonaventuriana 2018primera edició