Prozessüberwachung neu gedacht

Das Institut iRAP der Hochschule für Technik und Architektur Freiburg arbeitet zusammen mit dem Unternehmen GradeSens AG an einer komplett neuen Herangehensweise, um mit Sensoren den kompletten Spritzgiessprozess zu überwachen. Der neue innovative Ansatz basiert auf Beschleunigungssensoren, welche an ein Spritzgiesswerkzeug angebracht werden

MEMS acceleration sensor with remote optical readout for continuous power generator monitoring

Miniaturized accelerometers with remote optical readout are required devices for the continuous monitoring of vibrations inside power generators. In turbo and hydro generators, end-winding vibrations are present during operation causing in the long term undesirable out-of-service repairs. Continuous monitoring of these vibrations is therefore mandatory. The high electromagnetic fields in the generators impose the use of devices immune to electromagnetic interferences. In this paper a MEMS based accelerometer with remote optical readout is presented. Advantages of the proposed device are the use of a differential optical signal to reject the common mode signal and noise, the reduced number of steps for the MEMS chip fabrication and for the system assembly, and the reduced package volume

MEMS acceleration sensor with remote optical readout for continuous power generator monitoring

Miniaturized accelerometers with remote optical readout are required devices for the continuous monitoring of vibrations inside power generators. In turbo and hydro generators, end-winding vibrations are present during operation causing in the long term undesirable out-of-service repairs. Continuous monitoring of these vibrations is therefore mandatory. The high electromagnetic fields in the generators impose the use of devices immune to electromagnetic interferences. In this paper a MEMS based accelerometer with remote optical readout is presented. Advantages of the proposed device are the use of a differential optical signal to reject the common mode signal and noise, the reduced number of steps for the MEMS chip fabrication and for the system assembly, and the reduced package volume