An Organic Metal/Silver Nanoparticle Finish on Copper for Efficient Passivation and Solderability Preservation

For the first time, a complex formed by polyaniline (in its organic metal form) and silver has been deposited on copper in nanoparticulate form. When depositing on Cu pads of printed circuit boards it efficiently protects against oxidation and preserves its solderability. The deposited layer has a thickness of only nominally 50 nm, containing the Organic Metal (conductive polymer), polyaniline, and silver. With >90% (by volume), polyaniline (PAni) is the major component of the deposited layer, Ag is present equivalent to a 4 nm thickness. The Pani–Ag complex is deposited on Cu in form of about 100 nm small particles. Morphology, electrochemical characteristics, anti-oxidation and solderability results are reported

Relativistic K shell decay rates and fluorescence yields for Zn, Cd and Hg

In this work we use the multiconfiguration Dirac-Fock method to calculate the transition probabilities for all possible decay channels, radiative and radiationless, of a K shell vacancy in Zn, Cd and Hg atoms. The obtained transition probabilities are then used to calculate the corresponding fluorescence yields which are compared to existing theoretical, semi-empirical and experimental results

Integrated motor drives: state of the art and future trends

With increased need for high power density, high efficiency and high temperature capabilities in Aerospace and Automotive applications, Integrated Motor Drives (IMD) offers a potential solution. However, close physical integration of the converter and the machine may also lead to an increase in components temperature. This requires careful mechanical, structural and thermal analysis; and design of the IMD system. This paper reviews existing IMD technologies and their thermal effects on the IMD system. The effects of the power electronics (PE) position on the IMD system and its respective thermal management concepts are also investigated. The challenges faced in designing and manufacturing of an IMD along with the mechanical and structural impacts of close physical integration is also discussed and potential solutions are provided. Potential converter topologies for an IMD like the Matrix converter, 2-level Bridge, 3-level NPC and Multiphase full bridge converters are also reviewed. Wide band gap devices like SiC and GaN and their packaging in power modules for IMDs are also discussed. Power modules components and packaging technologies are also presented

XUV EMISSION FEATURES FROM THE LIVERMORE SOFT X-RAY LASER EXPERIMENTS

The measured wavelengths i n the soft x-ray region for 3p to 3s and 3d to 3p transitions in neon-, sodium-, and magnesium-like selenium are presented. The experimental results for the neon-like ions are compared to theoretical wavelength values and with values extrapolated along the isoelectronic sequence. The ions were contained in a plasma heated in a line-focus of a Nd-glass laser. The measurements were made with a time-gated microchannel-plate-intensified grazing incidence spectrograph