ATMOSPHERIC PRESSURE H 2 O PLASMA TREATMENT OF POLYESTER CORD THREADS

Polyester cord threads, which are used as a reinforcing materials of rubber blend, have been treated in atmospheric-pressure H2O plasma in order to enhance their adhesion to rubber. The atmospheric-pressure H2O plasma was generated in an underwater diaphragm discharge. The plasma treatment resulted in approximately 100% improvement in the adhesion. Scanning electron microscopy investigation indicates that not only introduced surface polar groups but also increased surface area of the fibres due to a fibre surface roughening are responsible for the improved adhesive strength

Fluorescence (TALIF) measurement of atomic hydrogen concentration in a coplanar surface dielectric barrier discharge

Spatially and temporally resolved measurements of atomic hydrogen concentration above the dielectric of coplanar barrier discharge are presented for atmospheric pressure in 2.2% H2/Ar. The measurements were carried out in the afterglow phase by means of two-photon absorption laser-induced fluorescence (TALIF). The difficulties of employing the TALIF technique in close proximity to the dielectric surface wall were successfully addressed by taking measurements on a suitable convexly curved dielectric barrier, and by proper mathematical treatment of parasitic signals from laser–surface interactions. It was found that the maximum atomic hydrogen concentration is situated closest to the dielectric wall from which it gradually decays. The maximum absolute concentration was more than 10^22 m-3. In the afterglow phase, the concentration of atomic hydrogen above the dielectric surface stays constant for a considerable time (10 us - 1 ms), with longer times for areas situated farther from the dielectric surface. The existence of such a temporal plateau was explained by the presented 1D model: the recombination losses of atomic hydrogen farther from the dielectric surface are compensated by the diffusion of atomic hydrogen from regions close to the dielectric surface. The fact that a temporal plateau exists even closest to the dielectric surface suggests that the dielectric surface acts as a source of atomic hydrogen in the afterglow phase

Parametric study of plasma-mediated thermoluminescence produced by Al2O3 sub-micron powders

Sub-micron Al2O3 powders with a surface activated by dielectric barrier discharge exhibit improved performance in wet deposition of ceramic layers. In addressing the possible mechanisms responsible for the observed improvement, a comprehensive thermoluminescence (TL) study of plasma-activated powders was performed. TL offers the unique possibility of exploring the population of intrinsic electrons/holes in the charge trapping states. This study covers a wide range of experimental conditions affecting the TL of powders: treatment time, plasma working gas composition, change of discharge configuration, step-annealing of powder, exposure to laser irradiation and aging time. Deconvoluted TL spectra were followed for the changes in their relative contributions. The TL spectra of all tested gases (air, Ar, N2 and 5% He in N2) consist of the well-known main dosimetric peak at 450 K and a peak of similar magnitude at higher temperatures, centered between 700 and 800 K depending on the working gas used. N2 plasma treatment gave rise to a new specific TL peak at 510 K, which exhibited several peculiarities. Initial thermal annealing of Al2O3 powders led to its significant amplification (unlike the other peaks); the peak was insensitive to optical bleaching, and it exhibited slow gradual growth during the long-term aging test. Besides its relevance to the ceramic processing studies, a comprehensive set of data is presented that provides a useful and unconventional view on plasma-mediated material changes

Selective Cu electroplating enabled by surface patterning and enhanced conductivity of carbon fiber reinforced polymers upon air plasma etching

We demonstrate a sustainable post-processing of carbon fiber reinforced epoxy polymer (CFRP) composites by air plasma etching that permits regular electroconductive surface patterning through direct Cu galvanic metallization, in contrast to the untreated composite. Our study reveals a significant property dependence of the composite with respect to the position to the fiber/matrix composite surface and treatment. The enhancement in electrical conductivity was not compromised by the lower structural integrity of the composite, as the embedded carbon fibers remained unaffected by the air plasma etching process. The metallized Cu domains on the composite exhibit good hardness and excellent solderability potential. Thus, the electroconductive surface patterning of the composite, preceding galvanic metallization, facilitates the selective deposition of Cu layer domains. This step by step process, relying on the creation of selective electroconductive areas on the composite by plasma etching, enables galvanic metallization. Consequently, it enhances the potential for multifunctional composite applications. The feasibility of galvanic metallization brings new perspectives in selective metallization of composites by allowing the tailoring of the metal layer thickness, microstructure and selection of the metal