Analysis of irradiation processes for laser-induced periodic surface structures

The influence of errors on the irradiation process for laser-induced periodic surface structures (LIPSS) was studied theoretically with energy density simulations. Therefore an irradiation model has been extended by a selection of technical variations. The influence of errors has been found in a deviation from optimal conditions, by a shift or spread of accumulated fluence and a variation of local fluence, related to variations of the peak fluence and relative pulse intersection. The analysis of the irradiation process by energy density simulations, gives the possibility to perform realistic irradiation simulations and derive optimization strategies for the determination of irradiation parameters. This analysis is required for the application of LIPSS for surface functionalization. © 2013 The Authors

Ultra-short-pulsed laser-machined nanogratings of laser-induced periodic surface structures on thin molybdenum layers

Large areas of regular diffraction nanogratings were produced consisting of so-called laser-induced periodic surface structures (LIPSS) on thin molybdenum layers (<400 nm) deposited on a borosilicate glass substrate. The aim was to produce these structures without ablating nor cracking the molybdenum layer. Ultra short laser pulses were applied using a focused Gaussian beam profile. Processing parameters such as laser fluence, pulse overlap, number of overscans, repetition frequency, wavelength and polarization were varied to study the effect on periodicity, height, and especially regularity of the obtained LIPSS. It was found that a careful choice of the correct laser parameters is required to avoid detrimental mechanical stresses, cracking, and delamination during the laser processing of the layer in order to remain in its correct range of ductility as well as to ensure regular LIPSS. A possible photovoltaic application of these nanogratings could be found in texturing of thin film cells to enhance light trapping mechanisms. © 2012 Society of Photo-Optical Instrumentation Engineers (SPIE)

Closed loop control of laserwelding using an optical spectroscopic sensor for Nd:Yag and CO2 lasers

Recent developments in laser joining show the applicability of spectral analysis of the plasma plume emission to monitor and control the quality of weld. The analysis of the complete spectra makes it possible to measure specific emission lines which reveal information about the welding process. The subsequent estimation of the electron temperature can be correlated with the quality of the corresponding weld seam. A typical quality parameter, for laser welds of stainless steel, is the achieved penetration depth of the weld. Furthermore adequate gas shielding of the welds has to be provided to avoid seam oxidation. In this paper monitoring and real-time control of the penetration depth during laser welding is demonstrated. Optical emissions in the range of 400nm and 560nm are collected by a fast spectrometer. The sensor data are used to determinethe weld quality of overlap welds in AISI 304 stainless steel sheets performed both with CW Nd:YAG and CO2 lasers. A PI-controller adjusts the laser power aiming at a constant penetration. Optical inspection of the weld surface and microscopic analysis of weld cross sections were used to verify the results obtained with the proposed closed-loop system of spectroscopic sensor and controller

Experimental validation of model for pulsed laser-induced subsurface modifications in Si

Wafers are traditionally diced with diamond saw blades. Saw dicing technology has a number of limitations, especially concerning the dicing of thin wafers. Moreover, the use of fluids and the gen-eration of debris can damage fragile components such as micro electro-mechanical systems. Laser ablation dicing is better suited for thin wafers, but is also not a clean process. An alternative dicing method is subsurface laser dicing. This technology is based on the production of laser-induced sub-surface modifications inside the wafer. These modifications weaken the material, such that the wafer separates along the planes with laser modifications when applying an external force. To find the right laser conditions to produce subsurface modifications in silicon, and to enhance the understand-ing of the underlying physics, a numerical model has previously been developed. To validate this model, the current work compares simulation results with experimental data obtained by focusing nano- and picosecond pulses inside silicon wafers. A fairly good agreement between experimental and numerical results was obtaine

Ejection Regimes in Picosecond Laser-Induced Forward Transfer of Metals

Laser-induced forward transfer (LIFT) is a 3D direct-write method suitable for precision printing of various materials, including pure metals. To understand the ejection mechanism and thereby improve deposition, here we present visualizations of ejection events at high-spatial (submicrometer) and high-temporal resolutions, for picosecond LIFT of copper and gold films with a thickness 50  nm≤d≤400  nm . For increasing fluences, these visualizations reveals the fluence threshold below which no ejection is observed, followed by the release of a metal cap (i.e., a hemisphere-shaped droplet), the formation of an elongated jet, and the release of a metal spray. For each ejection regime, the driving mechanisms are analyzed, aided by a two-temperature model. Cap ejection is driven by relaxation of thermal stresses induced by laser-induced heating, whereas jet and spray ejections are vapor driven (as the metal film is partly vaporized). We introduce energy balances that provide the ejection velocity in qualitative agreement with our velocity measurements. The threshold fluences separating the ejection regimes are determined. In addition, the fluence threshold below which no ejection is observed is quantitatively described using a balance between the surface energy and the inertia of the (locally melted) film. In conclusion, the ejection type can now be controlled, which allows for improved deposition of pure metal droplets and spray