Temperature Monitoring for Quality Prediction and Inventory Control in Cold Chain: a Case of 18℃ Ready-to-eat Food in Taiwan

The aim of the study was the development of a quality prediction model combined with the incoming analysis for temperature control in 18 degree ready-to-eat food during logistics flows. And analyzed how temperature monitoring improves inventory decision. Base on the growth of Pseudomonas sp., the model was developed by mathematical model with Gompertz model. The model predicts for quality as well as shelf life in the monitoring temperature is about 19.5 h. On the other hand, the incoming analysis shows that the inventory quantities at 7 ℃ and 18 ℃ is more than at 25 ℃.The model can be considered to be an effective tool (in combination with temperature monitoring) for improvement of quality management with the incoming consideration. Moreover, our results suggest that temperature-controlled food companies could share temperature information with its chain partners which emphases a food quality and logistics cost balance in supply chain

Temperature Monitoring for Quality Prediction and Inventory Control in Cold Chain: a Case of 18℃ Ready-to-eat Food in Taiwan

The aim of the study was the development of a quality prediction model combined with the incoming analysis for temperature control in 18 degree ready-to-eat food during logistics flows. And analyzed how temperature monitoring improves inventory decision. Base on the growth of Pseudomonas sp., the model was developed by mathematical model with Gompertz model. The model predicts for quality as well as shelf life in the monitoring temperature is about 19.5 h. On the other hand, the incoming analysis shows that the inventory quantities at 7 ℃ and 18 ℃ is more than at 25 ℃. The model can be considered to be an effective tool (in combination with temperature monitoring) for improvement of quality management with the incoming consideration. Moreover, our results suggest that temperature-controlled food companies could share temperature information with its chain partners which emphases a food quality and logistics cost balance in supply chain

Classical swine fever virus down-regulates endothelial connexin 43 gap junctions

Classical swine fever is a contagious disease of pigs characterized by fatal hemorrhagic fever. Classical swine fever virus (CSFV) induces the expression of pro-inflammatory and pro-coagulant factors of vascular endothelial cells and establishes a long-term infection. This study aimed to understand the effect of CSFV on endothelial connexin 43 (Cx43) expression and gap junctional intercellular coupling (GJIC). Porcine aortic endothelial cells were infected with CSFV at different multiplicity of infection for 48 h. Semi-quantitative RT-PCR, immunoconfocal microscopy, and Western blotting showed that the transcription and translation of Cx43 were reduced, and this was associated with an attenuation of GJIC. This decrease occurred in a time-dependent manner. An ERK inhibitor (PD98059), a JNK inhibitor (SP600125), and proteasome/lysosome inhibitors all significantly reversed the reduction in Cx43 protein levels without any influence on the titer of progeny virus. In addition, CSFV activated ERK and JNK in a time-dependent manner and down-regulated Cx43 promoter activity, mainly through decreased AP2 binding. This effect was primarily caused by the replication of CSFV rather than a consequence of cytokines being induced by CSFV infection of endothelial cells

A classification of logistic outsourcing levels and their impact on service performance: Evidence from the food processing industry

Most studies of logistics outsourcing have focused on cost reduction, while few studies have reported on service benefits. This study empirically examines if outsourcing different logistics activities results in differences in logistics service performance. We identify and analyze the outsourcing of four levels of logistics activities: transportation (level 1), packaging (level 2), transportation management (level 3), and distribution network management (level 4). A research framework was formulated to discuss the effect of the outsourcing decision of different levels on perceived logistics service performance and includes the moderating role that supply chain complexity may play in the proposed relationships. Our findings show that outsourcing has no direct impact on service performance (delivery reliability, flexibility and lead-time) in any of the four levels. However, the performance when outsourcing level 4 activities increases with an increasing degree of demand complexity. Furthermore, chilled foods have higher service performance than non-chilled foods. These findings show the complex relationships between levels of outsourcing, performance and supply chain characteristics.Logistics outsourcing Service Food industry Uncertainty

Enhanced thermal dissipation and light output of GaN/sapphire light-emitting diode by direct Cu electroplating

Using the self-alignment lithography and electroplating techniques, a lateral-electrodes GaN light-emitting diode (LED) with a microreflective cup and heat spreader has been demonstrated. The photoresist is used to be the electroplating forms and to produce the microreflective cup and heat spreader. Under 1 A injection, this type of LED presents an output power of 700 mW and a power conversion efficiency is up to two times as compared to that of the LEDs only on sapphire without a current spreader. The performance of LEDs with a microreflective cup and heat spreader is better than the vertical-electrode LEDs on Cu substrate. (C) 2008 The Electrochemical Society

Novel Device Design for High-Power InGaN/Sapphire LEDs Using Copper Heat Spreader With Reflector

Direct integration of InGaN/sapphire LED with a cup-shaped copper heat spreader was proposed for enhancing light extraction and heat dissipation by self-aligned photolithography and copper electroforming techniques. Based on optical simulation results, geometric design for a copper heat spreader is crucial to luminous property of an LED chip. An InGaN/sapphire LED embedded with the optimized cup-shaped copper heat spreader was demonstrated to exhibit superior light output power than a conventional LED by a factor of 2.68 times at an injection current of 1 A. Moreover, the power efficiency is remarkably increased from 4.2% to 15.7% at the same driven current. The improved device performance can be attributed to both of the enhanced light extraction of the laterally emitted light from an LED chip and efficient heat dissipation by the highly reflective and excellently thermal conductive copper heat spreader. These results suggest an efficient alternative simultaneously with two functions of thermal management and light extraction for high-power InGaN/sapphire LEDs application from chip to package design

Improved thermal management of GaN/sapphire light-emitting diodes embedded in reflective heat spreaders

Using maskless lithography and electroforming techniques, we have demonstrated an enhanced performance of GaN/sapphire light-emitting diode (LED) embedded in a reflective copper heat spreader. The chip size and dominant wavelength of the blue emitter used in this research is 1 X 1 mm(2) and 455 nm, respectively. The cup-shaped LED heat sink is electroformed on sapphire directly using the spin-coated photoresist coated with the Au/Cr/Ag mirror as a mold and dicing into the embedded LED with a Cu base dimension of 3 X 3 mm(2), which effectively enhances the heat dissipation down to the metal frame and reaps the light flux generated from the side emission. With the aid of a reflective heat spreader, the encapsulated LED sample driven at 1 A yields the light output power of 700 mW and around 2.7-times increase in the wall-plug efficiency compared to that of the conventional GaN/sapphire LED. Infrared thermal images confirm the GaN/sapphire LED with more efficient heat extraction and better temperature uniformity. These results exhibit an alternative solution to thermal management of high power LED-on-sapphire samples besides the laser lift-off technique. (C) 2008 American Institute of Physics