Highly Conductive Cu–Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles

Highly conductive Cu–Cu interconnections of SiC die with Ti/Ni/Cu metallization and direct bonded copper substrate for high-power semiconductor devices are achieved by the low-temperature sintering of Cu nanoparticles with a formic acid treatment. The Cu–Cu joints formed via a long-range sintering process exhibited good electrical conductivity and high strength. When sintered at 260 °C, the Cu nanoparticle layer exhibited a low resistivity of 5.65 μΩ·cm and the joints displayed a high shear strength of 43.4 MPa. When sintered at 320 °C, the resistivity decreased to 3.16 μΩ·cm and the shear strength increased to 51.7 MPa. The microstructure analysis demonstrated that the formation of Cu–Cu joints was realized by metallurgical bonding at the contact interface between the Cu pad and the sintered Cu nanoparticle layer, and the densely sintered layer was composed of polycrystals with a size of hundreds of nanometers. In addition, high-density twins were found in the interior of the sintered layer, which contributed to the improvement of the performance of the Cu–Cu joints. This bonding technology is suitable for high-power devices operating under high temperatures