A specification patterns system for discrete event systems analysis

As formal verification tools gain popularity, the problem arises of making them more accessible to engineers. A correct understanding of the logics used to express properties of a system's behavior is needed in order to guarantee that properties correctly encode the intent of the verification process. Writing appropriate properties, in a logic suitable for verification, is a skillful process. Errors in this step of the process can create serious problems since a false sense of safety is gained with the analysis. However, when compared to the effort put into developing and applying modeling languages, little attention has been devoted to the process of writing properties that accurately capture verification requirements. In this paper we illustrate how a collection of property patterns can help in simplifying the process of generating logical formulae from informally expressed requirements

High temperature charge and thermal transport properties of the n-type thermoelectric material PbSe

We present a detailed study of the charge transport, optical reflectivity, and thermal transport properties of n-type PbSe crystals. A strong scattering, mobility-limiting mechanism was revealed to be at play at temperatures above 500 K. The mechanism is indicative of complex electron-phonon interactions that cannot be explained by conventional acoustical phonon scattering alone. We applied the first order non-parabolicity approximation to extract the density of states effective mass as a function of doping both at room temperature and at 700 K. The results are compared to those of a parabolic band model and in the light of doping dependent studies of the infrared optical reflectivity. The thermal conductivity behavior as a function of temperature shows strong deviation from the expected Debye-Peierls high temperature behavior (umklapp dominated) indicating an additional heat carrying channel, which we associate with optical phonon excitations. The correlation of the thermal conductivity observations to the high temperature carrier mobility behavior is discussed. The thermoelectric figure of merit exhibits a promising value of ~0.8 at 700K at 1.5 x 10^{19}$ cm^-3.Comment: 14 figures, 2 tables, 12 pages, 53 reference