Immersion/Electroless Deposition of Cu on Ta

Continuous Cu films are deposited on Ta by a two-step process; galvanic displacement of Ta by Cu from ammonium fluoride solutions and subsequent electroless Cu deposition from a formaldehyde-containing bath. The conditions necessary for good adhesion are discussed. The extent of oxide film removal in the HF pretreatment solution is studied by electrochemical impedance spectroscopy. The charge-transfer resistance of about 57 Ω-cm2 is several orders of magnitude lower than that measured for the Ta native oxide. These results are consistent with the removal of the Ta2O5 portion of the native oxide

Applied Mathematics, Modelling and Computational Science

The Applied Mathematics, Modelling, and Computational Science (AMMCS) conference aims to promote interdisciplinary research and collaboration. The contributions in this volume cover the latest research in mathematical and computational sciences, modeling, and simulation as well as their applications in natural and social sciences, engineering and technology, industry, and finance. The 2013 conference, the second in a series of AMMCS meetings, was held August 26–30 and organized in cooperation with AIMS and SIAM, with support from the Fields Institute in Toronto, and Wilfrid Laurier University. There were many young scientists at AMMCS-2013, both as presenters and as organizers. This proceedings contains refereed papers contributed by the participants of the AMMCS-2013 after the conference. This volume is suitable for researchers and graduate students, mathematicians and engineers, industrialists, and anyone who would like to delve into the interdisciplinary research of applied and computational mathematics and its areas of applications